参数资料
型号: AD5663RBRMZ-3
厂商: Analog Devices Inc
文件页数: 20/32页
文件大小: 0K
描述: IC DAC NANO 16BIT 1.25V 10-MSOP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 50
系列: nanoDAC™
设置时间: 4µs
位数: 16
数据接口: 串行
转换器数目: 2
电压电源: 单电源
功率耗散(最大): 5mW
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-MSOP
包装: 管件
输出数目和类型: 2 电压,单极;2 电压,双极
采样率(每秒): 220k
产品目录页面: 783 (CN2011-ZH PDF)
配用: EVAL-AD5663REBZ-ND - BOARD EVAL FOR AD5663
Data Sheet
AD5623R/AD5643R/AD5663R
Rev. E | Page 27 of 32
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5663R
should have separate analog and digital sections, each having its
own area of the board.
If the AD5663R is in a system where other devices require an
AGND-to-DGND connection, the connection should be made at
one point only. This ground point should be as close as possible
to the AD5663R.
The power supply to the AD5663R should be bypassed with
10 F and 0.1 F capacitors. The capacitors should be located as
close as possible to the device, with the 0.1 F capacitor ideally
right up against the device. The 10 F capacitors are the
tantalum bead type. It is important that the 0.1 F capacitor
have low effective series resistance (ESR) and effective series
inductance (ESI), which is found, for example, in common
ceramic types of capacitors.
This 0.1 F capacitor provides a low impedance path to ground
for high frequencies caused by transient currents due to internal
logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and to reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals,
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique, where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.
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