- 您现在的位置：买卖IC网 > PDF目录10514 > AD6645ASVZ-80 (Analog Devices Inc)IC ADC 14BIT 80MSPS 52TQFP PDF资料下载
参数资料
| 型号： | AD6645ASVZ-80 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC ADC 14BIT 80MSPS 52TQFP |
| 设计资源： | Low Jitter Sampling Clock Generator for High Performance ADCs Using AD9958/9858 and AD9515 (CN0109) |
| 标准包装： | 1 |
| 位数： | 14 |
| 采样率（每秒）： | 80M |
| 数据接口： | 并联 |
| 转换器数目： | 4 |
| 功率耗散（最大）： | 1.75W |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 52-TQFP 裸露焊盘 |
| 供应商设备封装： | 52-TQFP-EP（10x10） |
| 包装： | 托盘 |
| 输入数目和类型： | 1 个差分，双极 |
AD6645
Rev. D | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Electrical
AVCC Voltage
0 V to 7 V
DVCC Voltage
0 V to 7 V
Analog Input Voltage
0 V to AVCC
Analog Input Current
25 mA
Digital Input Voltage
0 V to AVCC
Digital Output Current
4 mA
Environmental
Operating Temperature Range (Ambient)
AD6645-80
40°C to +85°C
AD6645-105
10°C to +85°C
Maximum Junction Temperature
150°C
Lead Temperature (Soldering, 10 sec)
300°C
Storage Temperature Range (Ambient)
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD6645ASVZ, 52-lead TQFP_EP (SV-52-1)
package must be soldered to the PCB GND plane to meet thermal
specifications.
Table 6. Thermal Characteristics
Package Type
Rating
52-Lead TQFP_EP
23°C/W, soldered heat sink
17°C/W, soldered heat sink
2°C/W, soldered heat sink
30°C/W, unsoldered heat sink
24°C/W, unsoldered heat sink
23°C/W, soldered heat sink
17°C/W, soldered heat sink
2°C/W
1 Per JEDEC JESD51-2 (heat sink soldered to PCB).
2 2S2P JEDEC test board.
3 Values of
θ
JA
are provided for package comparison and PCB design
considerations.
4 Per JEDEC JESD51-6 (heat sink soldered to PCB).
5 Airflow increases heat dissipation, effectively reducing θJA. Furthermore, the
more metal that is directly in contact with the package leads from metal
traces, throughholes, ground, and power planes, the more θJA is reduced.
6 Per MIL-STD-883, Method 1012.1.
7 Values of
θ
JC
are provided for package comparison and PCB design
considerations when an external heat sink is required.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where:
TA is the ambient temperature (°C).
PD is the power dissipation (W).
EXPLANATION OF TEST LEVELS
I.
100% production tested.
II.
100% production tested at 25°C and guaranteed by design
and characterization at temperature extremes.
III.
Sample tested only.
IV.
Parameter is guaranteed by design and characterization
testing.
V.
Parameter is a typical value only.
ESD CAUTION
相关PDF资料 |
PDF描述 |
|---|---|
| MAX3040CSE+ | IC RS485/422 TRANS QUAD 16-SOIC |
| MAX3041CSE+ | IC RS485/422 TRANS QUAD 16-SOIC |
| MAX3042BCUE+ | IC TX RS485/422 QUAD 16-TSSOP |
| VE-B53-IV-F4 | CONVERTER MOD DC/DC 24V 150W |
| VE-B53-IV-F3 | CONVERTER MOD DC/DC 24V 150W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD6645ASVZ-80 | 制造商:Analog Devices 功能描述:ADC, 14BIT, 80MSPS, TQFP-52 |
| AD6645ASVZ-801 | 制造商:AD 制造商全称:Analog Devices 功能描述:14-Bit, 80 MSPS/105 MSPS A/D Converter |
| AD6645-MIL/PCB | 功能描述:数据转换 IC 开发工具 AD6645-MIL/PCB EVAL. BD. RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| AD6645PCB | 制造商:AD 制造商全称:Analog Devices 功能描述:14-Bit, 80 MSPS A/D Converter |
| AD6645XSQ-105 | 制造商:Analog Devices 功能描述:- Bulk |
发布紧急采购，3分钟左右您将得到回复。