参数资料
| 型号： | AD7482ASTZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 10/21页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT SAR 3MSPS 48LQFP |
| 产品变化通告： | Product Discontinuance 27/Oct/2011 |
| 标准包装： | 1 |
| 位数： | 12 |
| 采样率（每秒）： | 3M |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 90mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-LQFP（7x7） |
| 包装： | 托盘 |
| 输入数目和类型： | 1 个单端，单极 |
AD7482
Rev. B | Page 17 of 20
BOARD LAYOUT AND GROUNDING
For optimum performance from the AD7482, it is recommended
that a PCB with a minimum of three layers be used. One of
these layers, preferably the middle layer, should be as complete a
ground plane as possible to give the best shielding. The board
should be designed in such a way that the analog and digital
circuitry is separated and confined to certain areas of the board.
This practice, along with not running digital and analog lines close
together, helps to avoid coupling digital noise onto analog lines.
The power supply lines to the AD7482 should be approximately
3 mm wide to provide low impedance paths and reduce the effects
of glitches on the power supply lines. It is vital that good decoupling
also be present. A combination of ferrites and decoupling capa-
citors should be used as shown in Figure 23. The decoupling
capacitors are to be as close to the supply pins as possible. This
is made easier by the use of multilayer boards. The signal traces
from the AD7482 pins can be run on the top layer, while the
decoupling capacitors and ferrites can be mounted on the bottom
layer where the power traces exist. The ground plane between
the top and bottom planes provides excellent shielding.
Figure 24 to Figure 28 show a sample layout of the board area
immediately surrounding the AD7482. Pin 1 is the bottom left
corner of the device. The black area in each figure indicates the
ground plane present on the middle layer Figure 24 shows the
top layer where the AD7482 is mounted with vias to the bottom
routing layer highlighted. Figure 25 shows the bottom layer
silkscreen where the decoupling components are soldered
directly beneath the device. Figure 26 shows the top and bottom
routing layers overlaid Figure 27 shows the bottom layer where
the power routing is with the same vias highlighted. Figure 28
shows the silkscreen overlaid on the solder pads for the decoupling
components, which are C1 to C6: 100 nF, C7 to C8: 470 nF, C9:
1 nF, and L1 to L4: Meggit-Sigma Chip Ferrite Beads
(BMB2A0600RS2).
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63
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0
24
Figure 24. Top Layer Routing
02
63
8-
0
26
Figure 25. Bottom Layer Silkscreen
02
63
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0
28
Figure 26. Top and Bottom Routing Layers
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5
Figure 27. Bottom Layer Routing
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26
38
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7
Figure 28. Silkscreen and Bottom Layer Routing
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7482BST | 制造商:Analog Devices 功能描述:ADC Single SAR 3Msps 12-bit Parallel 48-Pin LQFP 制造商:Rochester Electronics LLC 功能描述:12 BIT 3.5 MEG ADC IC - Tape and Reel 制造商:Analog Devices 功能描述:A/D Converter (A-D) IC |
| AD7482BSTZ | 功能描述:IC ADC 12BIT SAR 3MSPS 48-LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
| AD7484 | 制造商:AD 制造商全称:Analog Devices 功能描述:3MSPS, 14-Bit SAR ADC |
| AD7484BST | 制造商:Analog Devices 功能描述:ADC Single SAR 3Msps 14-bit Parallel 48-Pin LQFP 制造商:Rochester Electronics LLC 功能描述:14 BIT 3.0 MEG ADC IC - Tape and Reel 制造商:Analog Devices 功能描述:A/D Converter (A-D) IC |
| AD7484BSTZ | 功能描述:IC ADC 14BIT SAR 3MSPS 48-LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
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