参数资料
型号: AD7656BSTZ-1-RL
厂商: Analog Devices Inc
文件页数: 2/32页
文件大小: 0K
描述: IC ADC 16BIT 6CH 250KSPS 64LQFP
标准包装: 1,500
位数: 16
采样率(每秒): 250k
数据接口: 串行,并联
转换器数目: 6
功率耗散(最大): 143mW
电压电源: 模拟和数字,双 ±
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-LQFP
供应商设备封装: 64-LQFP(10x10)
包装: 带卷 (TR)
输入数目和类型: 6 个单端,双极
配用: EVAL-AD7656-1EDZ-ND - BOARD EVAL CONTROL AD7656-1
EVAL-AD7656-1CBZ-ND - BOARD EVAL FOR AD7656-1
EVAL-AD7656CBZ-ND - BOARD EVAL FOR AD7656
AD7656-1/AD7657-1/AD7658-1
Data Sheet
Rev. D | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to AGND, DGND
0.3 V to +16.5 V
VSS to AGND, DGND
+0.3 V to 16.5 V
VDD to AVCC
VCC 0.3 V to +16.5 V
AVCC to AGND, DGND
0.3 V to +7 V
DVCC to AVCC
0.3 V to AVCC + 0.3 V
DVCC to DGND, AGND
0.3 V to +7 V
AGND to DGND
0.3 V to +0.3 V
VDRIVE to DGND
0.3 V to DVCC + 0.3 V
Analog Input Voltage to AGND1
VSS 0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to VDRIVE + 0.3 V
Digital Output Voltage to DGND
0.3 V to VDRIVE + 0.3 V
REFIN/REFOUT to AGND
0.3 V to AVCC + 0.3 V
Input Current to Any Pin Except
Supplies2
±10 mA
Operating Temperature Range
B Version
40°C to +85°C
Y Version
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Pb/Sn Temperature, Soldering
Reflow (10 sec to 30 sec)
240(+0)°C
Pb-Free Temperature, Soldering Reflow
260(+0)°C
ESD
1.5 kV
1
If the analog inputs are driven from alternative VDD and VSS supply circuitry,
a 240 series resistor should be placed on the analog inputs and Schottky
diodes should be placed in series with the VDD and VSS supplies of the
AD7656-1/AD7657-1/AD7658-1.
2
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION
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