参数资料
型号: AD7835AP
厂商: Analog Devices Inc
文件页数: 26/28页
文件大小: 0K
描述: IC DAC 14BIT QUAD PARA 44-PLCC
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1
设置时间: 10µs
位数: 14
数据接口: 并联
转换器数目: 4
电压电源: 模拟和数字,双 ±
功率耗散(最大): 465mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 44-LCC(J 形引线)
供应商设备封装: 44-PLCC(16.59x16.59)
包装: 管件
输出数目和类型: 4 电压,单极;4 电压,双极
采样率(每秒): 100k
AD7834/AD7835
Rev. D | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. VCC must not exceed VDD by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in Figure 5 can be used to
provide protection.
Table 5.
AD7834/
AD7835
VDD
VCC
IN4148
SD103C
VDD
VCC
01006-005
Parameter
Rating
VCC to DGND
0.3 V to +7 V, or VDD + 0.3 V
(whichever is lower)
VDD to AGND
0.3 V to +17 V
VSS to AGND
+0.3 V to –17 V
Figure 5. Diode Protection
AGND to DGND
0.3 V to +0.3 V
0.3 V to VCC + 0.3 V
Digital Inputs to DGND
THERMAL RESISTANCE
VREF(+) to VREF(–)
0.3 V to +18 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
VREF(+) to AGND
VSS – 0.3 V to VDD + 0.3 V
VREF(–) to AGND
VSS – 0.3 V to VDD + 0.3 V
DSG to AGND
Table 6. Thermal Resistance
VOUT (1–4) to AGND
VSS – 0.3 V to VDD + 0.3 V
Package Type
θJA
Unit
Operating Temperature Range, TA
PDIP
75
°C/W
40°C to +85°C
Industrial (A Version)
SOIC
75
°C/W
65°C to +150°C
Storage Temperature Range
MQFP
95
°C/W
150°C
Junction Temperature, TJ (max)
PLCC
55
°C/W
Power Dissipation, PD (max)
(TJ TA)/θJA
Lead Temperature
JEDEC Industry Standard
ESD CAUTION
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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