参数资料
型号: AD7858LBNZ
厂商: Analog Devices Inc
文件页数: 26/32页
文件大小: 0K
描述: IC ADC 12BIT 8CHAN SRL 24DIP
产品变化通告: Product Discontinuance 27/Oct/2011
标准包装: 15
位数: 12
采样率(每秒): 100k
数据接口: 8051,QSPI?,串行,SPI? µP
转换器数目: 2
功率耗散(最大): 33mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 24-DIP(0.300",7.62mm)
供应商设备封装: 24-PDIP
包装: 管件
输入数目和类型: 8 个单端,单极;4 个伪差分,单极
REV. B
–32–
AD7858/AD7858L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Plastic DIP (N-24)
24
112
13
0.260
0.001
(6.61
0.03)
PIN 1
1.228 (31.19)
1.226 (31.14)
SEATING
PLANE
0.02 (0.5)
0.016 (0.41)
0.07 (1.78)
0.05 (1.27)
0.32 (8.128)
0.30 (7.62)
0.011 (0.28)
0.009 (0.23)
0.130 (3.30)
0.128 (3.25)
0.11 (2.79)
0.09 (2.28)
15
0
NOTES
1. LEAD NO. 1 IDENTIFIED BY A DOT OR NOTCH.
2. PLASTIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Small Outline Package (R-24)
24
13
12
1
0.608 (15.45)
0.596 (15.13)
0.414
(10.52)
0.398
(10.10)
0.299
(7.6)
0.291
(7.39)
PIN 1
SEATING
PLANE
0.01 (0.254)
0.006 (0.15)
0.019 (0.49)
0.014 (0.35)
0.096 (2.44)
0.089 (2.26)
0.05
(1.27)
BSC
0.013 (0.32)
0.009 (0.23)
0.042 (1.067)
0.018 (0.447)
6
0
0.03 (0.76)
0.02 (0.51)
NOTES
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Shrink Small Outline Package (RS-24)
24
1
13
12
0.328 (8.33)
0.318 (8.08)
0.311
(7.9)
0.301
(7.64)
0.212
(5.38)
0.205
(5.207)
PIN 1
SEATING
PLANE
0.008 (0.203)
0.002 (0.050)
0.07 (1.78)
0.066 (1.67)
0.0256
(0.65)
BSC
0.015 (0.38)
0.010 (0.25)
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
8
0
NOTES
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
C01337–0–6/00
PRINTED
IN
U.S.A.
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