参数资料
型号: AD7892ANZ-1
厂商: Analog Devices Inc
文件页数: 8/14页
文件大小: 0K
描述: IC ADC 12BIT LP 500KSPS 24DIP
标准包装: 15
位数: 12
采样率(每秒): 500k
数据接口: 串行,并联
转换器数目: 1
功率耗散(最大): 90mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 24-DIP(0.300",7.62mm)
供应商设备封装: 24-PDIP
包装: 管件
输入数目和类型: 2 个单端,双极
ABSOLUTE MAXIMUM RATINGS*
(TA = +25
°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
AD7892-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±17 V
AD7892-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
AD7892-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±7 V
Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40
°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Parameter
A Versions
1
B Versions
S Version
2
Unit
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, VOH
4.0
V min
ISOURCE = 200
A
Output Low Voltage, VOL
0.4
V max
ISINK = 1.6 mA
DB11–DB0
Floating-State Leakage Current
±10
A max
Floating-State Capacitance
4
15
pF max
Output Coding
AD7892-1 and AD7892-3
Two’s Complement
AD7892-2
Straight (Natural) Binary
CONVERSION RATE
Conversion Time
1.47
s max
AD7892-3
Track/Hold Acquisition Time
3
0.2
s max
AD7892-3
Conversion Time
1.6
1.68
s max
AD7892-1 and AD7892-2
Track/Hold Acquisition Time
3
0.4
0.32
s max
AD7892-1 and AD7892-2
POWER REQUIREMENTS
VDD
+5
V nom
±5% for Specified Performance
IDD
5
Normal Operation
18
19
mA max
Standby Mode
6
AD7892-2
250
A typ
AD7892-3, AD7892-1
80
100
A max
typ 15
A
Power Dissipation
5
Normal Operation
90
95
mW max
VDD = +5 V. Typically 60 mW
Standby Mode
6
AD7892-2
1.25
mW typ
AD7892-3, AD7892-1
400
500
W max
VDD = +5 V. Typically 75
W
NOTES
1Temperature ranges are as follows: A, B Versions: –40
°C to +85°C; S Version: –55°C to +125°C.
2S Version available on AD7892-1 and AD7892-2 only.
3See Terminology.
4Sample tested @ +25
°C to ensure compliance.
5These normal mode and standby mode currents are achieved with resistors (in the range 10 k
to 100 k) to either DGND or V
DD on Pins 8, 9, 16 and 17.
6A conversion should not be initiated on the part within 30
s of exiting standby mode.
Specifications subject to change without notice.
AD7892
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260
°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
REV. C
–3–
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