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参数资料
| 型号： | AD7892ARZ-1 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 5/14页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT LP 500KSPS 24-SOIC |
| 标准包装： | 31 |
| 位数： | 12 |
| 采样率（每秒）： | 500k |
| 数据接口： | 串行，并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 90mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC W |
| 包装： | 管件 |
| 输入数目和类型： | 2 个单端，双极 |
| 产品目录页面： | 779 (CN2011-ZH PDF) |
AD7892
REV. C
–13–
Grounding and Layout
The AD7892 has a single supply voltage pin, VDD, which sup-
plies both the analog and digital circuitry on the part. For opti-
mum performance from the part, it is recommended that this
+5 V is taken from the +5 V analog supply in the system. The
analog and digital grounds to the AD7892 are independent and
separately pinned out to minimize coupling between the analog
and digital sections of the device. The part exhibits good immu-
nity to noise on the supplies but care must still be taken with
regard to grounding and layout especially when using switching
mode supplies.
The printed circuit board which houses the AD7892 should be
designed such that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes which can be separated easily. A minimum
etch technique is generally best for ground planes as it gives the
best shielding. Digital and analog ground planes should only be
joined in one place. If the AD7892 is the only device requiring
an AGND to DGND connection, then the ground planes
should be connected at the AGND and DGND pins of the
AD7892. If the AD7892 is in a system where multiple devices
require AGND to DGND connections, the connection should
still be made at one point only, a star ground point which
should be established as close as possible to the AD7892.
Avoid running digital lines under the device as these will couple
noise onto the die. The analog ground plane should be allowed
to run under the AD7892 to avoid noise coupling. The power
supply lines to the AD7892 should use as large a trace as pos-
sible to provide low impedance paths and reduce the effects of
glitches on the power supply line. Fast switching signals like
clocks should be shielded with digital ground to avoid radiating
noise to other sections of the board and clock signals should
never be run near the analog inputs. Avoid crossover of digital
and analog signals. Traces on opposite sides of the board should
run at right angles to each other. This will reduce the effects of
feedthrough through the board. A microstrip technique is by far
the best but is not always possible with a double-sided board. In
this technique, the component side of the board is dedicated to
ground planes while signals are placed on the solder side.
Good decoupling is important when using high resolution ADCs.
All analog supplies should be decoupled with 10
F tantalum in
parallel with 0.1
F capacitors to AGND. To achieve the best
from these decoupling components, they have to be placed as
close as possible to the device, ideally right up against the device.
All logic chips should be decoupled with 0.1
F disc ceramic
capacitors to DGND. It is recommended that the system’s
AVDD supply is used to supply the VDD for the AD7892. This
supply should have the recommended analog supply decoupling
capacitors between the VDD pin of the AD7892 and AGND and
the recommended digital supply decoupling capacitor between
the VDD pin of the AD7892 and DGND.
Evaluating the AD7892 Performance
The recommended layout for the AD7892 is outlined in the
evaluation board for the AD7892. The evaluation board package
includes a fully assembled and tested evaluation board, docu-
mentation and software for controlling the board from a PC
using the EVAL-CONTROL BOARD. The EVAL-CONTROL
BOARD can be used in conjunction with the AD7892 evalua-
tion board, as well as many other Analog Devices evaluation
boards ending in the CB designator. Using the EVAL-CONTROL
BOARD with the AD7892 evaluation board allows the user to
evaluate the ac and dc performance of the AD7892 on a PC.
The software provided with the evaluation board allows the user
to perform ac (Fast Fourier Transform) and dc (histogram of
codes) tests on the AD7892. The evaluation board can also
be used in a stand-alone fashion without the EVAL-CONTROL
BOARD but in this case, the user has to write their own software
to evaluate the part. There are two versions of the evaluation
board available, one for the AD7892-2 and one for the AD7892-3.
To order the AD7892-2 evaluation board, the order number is
EVAL-AD7892-2CB and to order the AD7892-3 evaluation
board, the order number is EVAL-AD7892-3CB.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7892ARZ-1 | 制造商:Analog Devices 功能描述:IC 12-BIT ADC 制造商:Analog Devices 功能描述:IC, 12-BIT ADC |
| AD7892ARZ-1REEL | 功能描述:IC ADC 12BIT LP 500KSPS 24-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
| AD7892ARZ-2 | 功能描述:IC ADC 12BIT LP 500KSPS 24SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
| AD7892ARZ-2REEL | 功能描述:IC ADC 12BIT LP 500KSPS 24SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
| AD7892ARZ-3 | 功能描述:IC ADC 12BIT LP 600KSPS 24SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
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