- 您现在的位置：买卖IC网 > PDF目录10212 > AD7951BCPZRL (Analog Devices Inc)IC ADC 14BIT 1MSPS 48-LFCSP PDF资料下载
参数资料
| 型号： | AD7951BCPZRL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 25/32页 |
| 文件大小： | 0K |
| 描述： | IC ADC 14BIT 1MSPS 48-LFCSP |
| 标准包装： | 2,500 |
| 系列： | PulSAR® |
| 位数： | 14 |
| 采样率（每秒）： | 1M |
| 数据接口： | 串行，并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 260mW |
| 电压电源： | 模拟和数字，双 ± |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 48-LFCSP-VQ（7x7） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 1 个差分，双极 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页当前第25页第26页第27页第28页第29页第30页第31页第32页
Data Sheet
AD7951
Rev. A | Page 31 of 32
APPLICATION INFORMATION
LAYOUT GUIDELINES
While the AD7951 has very good immunity to noise on the
power supplies, exercise care with the grounding layout. To
facilitate the use of ground planes that can be easily separated,
design the printed circuit board that houses the AD7951 so that
the analog and digital sections are separated and confined to
certain areas of the board. Digital and analog ground planes
should be joined in only one place, preferably underneath the
AD7951, or as close as possible to the AD7951. If the AD7951 is
in a system where multiple devices require analog-to-digital
ground connections, the connections should still be made at one
point only, a star ground point, established as close as possible to
the AD7951.
To prevent coupling noise onto the die, avoid radiating noise,
and to reduce feedthrough:
Do not run digital lines under the device.
Do run the analog ground plane under the AD7951.
Shield fast switching signals, like CNVST or clocks, with
digital ground to avoid radiating noise to other sections of
the board, and never run them near analog signal paths.
Avoid crossover of digital and analog signals.
Run traces on different but close layers of the board, at right
angles to each other, to reduce the effect of feedthrough through
the board.
The power supply lines to the AD7951 should use as large a trace as
possible to provide low impedance paths and reduce the effect of
glitches on the power supply lines. Good decoupling is also
important to lower the impedance of the supplies presented to
the AD7951, and to reduce the magnitude of the supply spikes.
Decoupled ceramic capacitors, typically 100 nF, should be placed
on each of the power supplies pins, AVDD, DVDD, and OVDD,
VCC, and VEE. The capacitors should be placed close to, and
ideally right up against, these pins and their corresponding ground
pins. Additionally, low ESR 10 μF capacitors should be located
in the vicinity of the ADC to further reduce low frequency ripple.
The DVDD supply of the AD7951 can either be a separate supply
or come from the analog supply, AVDD, or from the digital
interface supply, OVDD. When the system digital supply is noisy,
or fast switching digital signals are present, and no separate supply
is available, it is recommended to connect the DVDD digital supply
to the analog supply AVDD through an RC filter, and to connect
the system supply to the interface digital supply OVDD and the
remaining digital circuitry. See Figure 27 for an example of this
configuration. When DVDD is powered from the system supply,
it is useful to insert a bead to further reduce high frequency spikes.
The AD7951 has four different ground pins: REFGND, AGND,
DGND, and OGND.
REFGND senses the reference voltage and, because it carries
pulsed currents, should be a low impedance return to the
reference.
AGND is the ground to which most internal ADC analog
signals are referenced; it must be connected with the least
resistance to the analog ground plane.
DGND must be tied to the analog or digital ground plane
depending on the configuration.
OGND is connected to the digital system ground.
The layout of the decoupling of the reference voltage is important.
To minimize parasitic inductances, place the decoupling capacitor
close to the ADC and connect it with short, thick traces.
EVALUATING PERFORMANCE
A recommended layout for the AD7951 is outlined in the
EVAL-AD7951EDZ evaluation board documentation. The
evaluation board package includes a fully assembled and tested
evaluation board, documentation, and software for controlling
the board from a PC via the EVAL-CED1Z.
相关PDF资料 |
PDF描述 |
|---|---|
| SP3087EEN-L/TR | IC TXRX RS485/RS422 ESD 8NSOIC |
| SP3086EEN-L/TR | IC TXRX RS485/RS422 ESD 14NSOIC |
| NE570DR2G | IC COMPANDOR DUAL GAIN 16-SOIC |
| AD7952BSTZRL | IC ADC 14BIT DIFF 1MSPS 48-LQFP |
| LTC2280CUP#TRPBF | IC ADC DUAL 10BIT 105MSPS 64-QFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7951BSTZ | 功能描述:IC ADC 14BIT 1MSPS 48-LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:PulSAR® 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
| AD7951BSTZRL | 功能描述:IC ADC 14BIT 1MSPS 48-LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:PulSAR® 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
| AD7952 | 制造商:AD 制造商全称:Analog Devices 功能描述:14-Bit, 1 MSPS, Differential, Programmable Input PulSAR ADC |
| AD7952BCPZ | 功能描述:IC ADC 14BIT DIFF 1MSPS 48LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:PulSAR® 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
| AD7952BCPZRL | 功能描述:IC ADC 14BIT DIFF 1MSPS 48LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:PulSAR® 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
发布紧急采购，3分钟左右您将得到回复。