参数资料
| 型号： | AD8029AKSZ-R2 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/25页 |
| 文件大小： | 0K |
| 描述： | IC AMP GP R-R LP 170MA SC70-6 |
| 标准包装： | 1 |
| 放大器类型： | 通用 |
| 电路数： | 1 |
| 输出类型： | 满摆幅 |
| 转换速率： | 63 V/µs |
| -3db带宽： | 125MHz |
| 电流 - 输入偏压： | 1.7µA |
| 电压 - 输入偏移： | 2000µV |
| 电流 - 电源： | 1.4mA |
| 电流 - 输出 / 通道： | 170mA |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 12 V，±1.35 V ~ 6 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TSSOP，SC-88，SOT-363 |
| 供应商设备封装： | SC-70-6 |
| 包装： | 剪切带 (CT) |
| 其它名称： | AD8029AKSZ-R2CT |
Data Sheet
AD8029/AD8030/AD8040
Rev. B | Page 19 of 24
CIRCUIT CONSIDERATIONS
PCB Layout
High speed op amps require careful attention to PCB layout to
achieve optimum performance. Particular care must be
exercised to minimize lead lengths of the bypass capacitors.
Excess lead inductance can influence the frequency response
and even cause high frequency oscillations. Using a multilayer
board with an internal ground plane can help reduce ground
noise and enable a more compact layout.
To achieve the shortest possible trace length at the inverting
input, the feedback resistor, RF, should be located the shortest
distance from the output pin to the input pin. The return node
of the resistor RG should be situated as close as possible to the
return node of the negative supply bypass capacitor.
On multilayer boards, all layers beneath the op amp should be
cleared of metal to avoid creating parasitic capacitive elements.
This is especially true at the summing junction, i.e., the inver-
ting input, –IN. Extra capacitance at the summing junction can
cause increased peaking in the frequency response and lower
phase margin.
Grounding
To minimize parasitic inductances and ground loops in high
speed, densely populated boards, a ground plane layer is critical.
Understanding where the current flows in a circuit is critical in
the implementation of high speed circuit design. The length of
the current path is directly proportional to the magnitude of the
parasitic inductances and thus the high frequency impedance of
the path. Fast current changes in an inductive ground return
will create unwanted noise and ringing.
The length of the high frequency bypass capacitor pads and
traces is critical. A parasitic inductance in the bypass grounding
works against the low impedance created by the bypass
capacitor. Because load currents flow from supplies as well as
from ground, the load should be placed at the same physical
location as the bypass capacitor ground. For large values of
capacitors, which are intended to be effective at lower
frequencies, the current return path length is less critical.
Power Supply Bypassing
Power supply pins are actually inputs to the op amp. Care must
be taken to provide the op amp with a clean, low noise dc
voltage source.
Power supply bypassing is employed to provide a low imped-
ance path to ground for noise and undesired signals at all
frequencies. This cannot be achieved with a single capacitor
type; but with a variety of capacitors in parallel the bandwidth
of power supply bypassing can be greatly extended. The bypass
capacitors have two functions:
1. Provide a low impedance path for noise and undesired
signals from the supply pins to ground.
2. Provide local stored charge for fast switching conditions
and minimize the voltage drop at the supply pins during
transients. This is typically achieved with large electrolytic
capacitors.
Good quality ceramic chip capacitors should be used and
always kept as close as possible to the amplifier package. A
parallel combination of a 0.1 F ceramic and a 10 F electrolytic
covers a wide range of rejection for unwanted noise. The 10 F
capacitor is less critical for high frequency bypassing and, in
most cases, one per supply line is sufficient. The values of
capacitors are circuit-dependant and should be determined by
the system’s requirements.
DESIGN TOOLS AND TECHNICAL SUPPORT
Analog Devices is committed to the design process by providing
technical support and online design tools. ADI offers technical
support via free evaluation boards, sample ICs, Spice models,
interactive evaluation tools, application notes, phone and email
support—all available at www.analog.com.
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相关代理商/技术参数 |
参数描述 |
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| AD8029AKSZ-R2 | 制造商:Analog Devices 功能描述:IC OP-AMP 125MHZ 62V/S SC-70-6 |
| AD8029AKSZ-REEL | 功能描述:IC AMP GP R-R LP 170MA SC70-6 RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:160 系列:- 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:10 V/µs 增益带宽积:9MHz -3db带宽:- 电流 - 输入偏压:1pA 电压 - 输入偏移:250µV 电流 - 电源:730µA 电流 - 输出 / 通道:28mA 电压 - 电源，单路/双路(±):2.7 V ~ 5.5 V，±1.35 V ~ 2.75 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC N 包装:管件 |
| AD8029AKSZ-REEL7 | 功能描述:IC AMP GP R-R LP 170MA SC70-6 RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Differential Circuit Design Techniques for Communication Applications 标准包装:1 系列:- 放大器类型:RF/IF 差分 电路数:1 输出类型:差分 转换速率:9800 V/µs 增益带宽积:- -3db带宽:2.9GHz 电流 - 输入偏压:3µA 电压 - 输入偏移:- 电流 - 电源:40mA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VQFN 裸露焊盘，CSP 供应商设备封装:16-LFCSP-VQ 包装:剪切带 (CT) 产品目录页面:551 (CN2011-ZH PDF) 其它名称:ADL5561ACPZ-R7CT |
| AD8029AR | 制造商:Rochester Electronics LLC 功能描述:LOW POWER HIGH SPEED OP AMP - Bulk |
| AD8029AR-EBZ | 功能描述:BOARD EVAL FOR AD8029AR RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
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