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参数资料
| 型号： | AD8052 |
| 厂商： | Analog Devices, Inc. |
| 英文描述： | Low Cost, High Speed Rail-to-Rail Amplifiers |
| 中文描述： | 低成本，高速轨到轨放大器 |
| 文件页数： | 5/16页 |
| 文件大小： | 267K |
| 代理商： | AD8052 |
–5–
AD8051/AD8052/AD8054
REV. B
ABSOLUTE MAXIMUM RATINGS
1
SupplyVoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6V
InternalPowerDissipation
2
SmallOutlinePackage (R) . . . Observe Power Derating Curves
SOT-23-5 Package . . . . . . . . Observe Power Derating Curves
μ
SOIC Package . . . . . . . . . . Observe Power Derating Curves
TSSOP-14 Package . . . . . . . Observe Power Derating Curves
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
DifferentialInputVoltage . . . . . . . . . . . . . . . . . . . . . . .
±
2.5V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range (R) . . . . . . . . . –65
°
C to +125
°
C
Operating Temperature Range (A Grade) . . . –40
°
C to +85
°
C
Lead Temperature Range (Soldering10sec) . . . . . . . . +300
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead SOIC:
θ
JA
= 155
°
C/W
5-Lead SOT-23-5:
θ
JA
= 240
°
C/W
8-Lead
μ
SOIC:
θ
JA
= 200
°
C/W
14-Lead SOIC:
θ
JA
= 120
°
C/W
14-Lead TSSOP:
θ
JA
= 180
°
C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8051/
AD8052/AD8054 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transi-
tion temperature of the plastic, approximately +150
°
C. Tempo-
rarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die by
the package. Exceeding a junction temperature of +175
°
C for an
extended period can result in device failure.
While the AD8051/AD8052/AD8054 are internally short circuit
protected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150
°
C) is not exceeded under
all conditions. To ensure proper operation, it is necessary to ob-
serve the maximum power derating curves.
AMBIENT TEMPERATURE –
8
C
–50
0
T
J
= +150
8
C
2.0
1.5
1.0
0.5
8-LEAD SOIC
PACKAGE
–40 –30 –20 –10
0
10
20
30
40
50
60
70 80
90
m
SOIC
SOT-23-5
14-LEAD SOIC
M
14-LEAD TSSOP-14
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature for AD8051/AD8052/AD8054
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8051/AD8052/AD8054 feature proprietary ESD protection circuitry, perma-
nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Temperature
Range
Package
Descriptions
Package
Options*
Brand
Code
Model
AD8051AR
AD8051AR-REEL
AD8051AR-REEL7
AD8051ART-REEL
AD8051ART-REEL7
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
8-Lead SOIC
13" Tape and Reel
7" Tape and Reel
13" Tape and Reel
7" Tape and Reel
SO-8
SO-8
SO-8
RT-5
RT-5
H2A
H2A
AD8052AR
AD8052AR-REEL
AD8052AR-REEL7
AD8052ARM
AD8052ARM-REEL
AD8052ARM-REEL7
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
8-Lead SOIC
13" Tape and Reel
7" Tape and Reel
8-Lead
μ
SOIC
13" Tape and Reel
7" Tape and Reel
SO-8
SO-8
SO-8
RM-8
RM-8
RM-8
H4A
H4A
H4A
AD8054AR
AD8054AR-REEL
AD8054AR-REEL7
AD8054ARU
AD8054ARU-REEL
AD8054ARU-REEL7
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
14-Lead SOIC
13" Tape and Reel
7" Tape and Reel
14-Lead
μ
SOIC
13" Tape and Reel
7" Tape and Reel
R-14
R-14
R-14
RU-14
RU-14
RU-14
*R = Small Outline; RM = Micro Small Outline; RT = Surface Mount; RU = TSSOP .
相关PDF资料 |
PDF描述 |
|---|---|
| AD8052AR | 16-Bit, 4-Channel Serial Output Sampling Analog-To-Digital Converter 16-SSOP/QSOP |
| AD8052AR-REEL | 16-Bit, 4-Channel Serial Output Sampling Analog-To-Digital Converter 16-SSOP/QSOP |
| AD8052AR-REEL7 | Low Cost, High Speed Rail-to-Rail Amplifiers |
| AD8052ARM | Low Cost, High Speed Rail-to-Rail Amplifiers |
| AD8052ARM-REEL | Low Cost, High Speed Rail-to-Rail Amplifiers |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD8052AR | 功能描述:IC OPAMP VF R-R DUAL LDIST 8SOIC RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:J-FET 电路数:2 输出类型:- 转换速率:3.5 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:30pA 电压 - 输入偏移:2000µV 电流 - 电源:200µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-PDIP 包装:管件 |
| AD8052AR TUBE | 制造商:Analog Devices 功能描述:AMP DUAL HSPEED RRO/P (TUBE98) SMD |
| AD8052AR-EBZ | 功能描述:BOARD EVAL FOR AD8052AR RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
| AD8052ARM | 功能描述:IC OPAMP VF R-R DUAL LDIST 8MSOP RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:J-FET 电路数:2 输出类型:- 转换速率:3.5 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:30pA 电压 - 输入偏移:2000µV 电流 - 电源:200µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-PDIP 包装:管件 |
| AD8052ARM-EBZ | 功能描述:BOARD EVAL FOR AD8052ARM RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
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