参数资料
| 型号： | AD8137YR |
| 厂商： | Analog Devices Inc |
| 文件页数： | 2/33页 |
| 文件大小： | 0K |
| 描述： | IC AMP DIFF R-R LP 20MA 8SOIC |
| 标准包装： | 98 |
| 放大器类型： | 差分 |
| 电路数： | 1 |
| 输出类型： | 差分，满摆幅 |
| 转换速率： | 450 V/µs |
| -3db带宽： | 110MHz |
| 电流 - 输入偏压： | 500nA |
| 电压 - 输入偏移： | 700µV |
| 电流 - 电源： | 3.2mA |
| 电流 - 输出 / 通道： | 20mA |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 12 V，± 2.7 V ~ 6 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
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Data Sheet
AD8137
Rev. E | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
12 V
VOCM
VS+ to VS
Power Dissipation
Input Common-Mode Voltage
VS+ to VS
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +125°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for the device soldered in a circuit board in still air.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead SOIC/2-Layer
157
56
°C/W
8-Lead SOIC/4-Layer
125
56
°C/W
8-Lead LFCSP/4-Layer
70
56
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8137 package
is limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit may change the stresses that
the package exerts on the die, permanently shifting the parametric
performance of the AD8137. Exceeding a junction temperature
of 175°C for an extended period can result in changes in the
silicon devices, potentially causing failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). The load current consists of differential
and common-mode currents flowing to the load, as well as
currents flowing through the external feedback networks and
the internal common-mode feedback loop. The internal resistor
tap used in the common-mode feedback loop places a 1 k
differential load on the output. RMS output voltages should be
considered when dealing with ac signals.
Airflow reduces θJA. In addition, more metal directly in contact
with the package leads from metal traces, through holes, ground,
and power planes reduces the θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 8-lead SOIC
(125°C/W) and 8-lead LFCSP (θJA = 70°C/W) on a JEDEC
standard 4-layer board. θJA values are approximations.
–40
–20 –10
–30
0
10 20 30 40 50 60 70 80 90 100 110 120
3.0
MAXIMUM
POWER
DISSIPATION
(W)
1.0
1.5
0.5
2.0
2.5
0
AMBIENT TEMPERATURE (°C)
SOIC-8
LFCSP
04771-0-022
Figure 3. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
ESD CAUTION
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