AD815
REV. B
–16–
C
P
15-Lead Surface Mount DDPAK
(VR-15)
1
0
0
0.080 (2.03)
0.065 (1.65)
2 PLACES
0.516
(13.106)
0.110
(2.79)
BSC
0.042
(1.066)
TYP
0.137
(3.479)
TYP
0.394
(10.007)
0.152 (3.86)
0.148 (3.76)
0.600 (15.24)
BSC
0.079 (2.006)
DIA
2 PLACES
15
0.024 (0.61)
0.014 (0.36)
0.063 (1.60)
0.057 (1.45)
8
°
0
°
0
0
0
0
SEATING
PLANE
0.031 (0.79)
0.024 (0.60)
0.100 (2.54)
BSC
0.798 (20.27)
0.778 (19.76)
0.182 (4.62)
0.172 (4.37)
0.146 (3.70)
0.138 (3.50)
PIN 1
15-Lead Through-Hole SIP with Staggered Leads and
90
8
Lead Form (Y-15)
0.063 (1.60)
0.057 (1.45)
0.671
±
0.006
(17.043
±
0.152)
SHORT
LEAD
0.024 (0.61)
0.014 (0.36)
0.666
±
0.006
(16.916
±
0.152)
LONG
LEAD
0
±
0
(
±
0
0
±
0
(
±
0
0
±
0
(
±
0
0
0
PIN 1
0.110
(2.79)
BSC
0.394
(10.007)
0.152 (3.86)
0.148 (3.76)
0.080 (2.03)
0.065 (1.65)
2 PLACES
0
0.042
(1.066)
TYP
0.137
(3.479)
TYP
0.079 (2.006)
2 PLACES
0
0
1
15
0.700 (17.78) BSC
SEATING
PLANE
0.031 (0.79)
0.024 (0.60)
0.050
(1.27)
BSC
0.798 (20.27)
0.778 (19.76)
0.182 (4.62)
0.172 (4.37)
0.209
±
0.010
(5.308
±
0.254)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Thermally Enhanced SOIC
(RB-24)
24
13
12
1
0.6141 (15.60)
0.5985 (15.20)
0
0
0
0
PIN 1
SEATING
PLANE
0.0118 (0.30)
0.0040 (0.10)
0.0201 (0.51)
0.0130 (0.33)
0.1043 (2.65)
0.0926 (2.35)
0.0500
(1.27)
BSC
0.0125 (0.32)
0.0091 (0.23)
0.0500 (1.27)
0.0157 (0.40)
8
°
0
°
0.0291 (0.74)
°
15-Lead Through-Hole SIP with Staggered Leads and
Straight Lead Form (YS-15)
0.080 (2.03)
0.065 (1.65)
2 PLACES
0
0
PIN 1
0.110
(2.79)
BSC
0.042
(1.07)
TYP
0.137
(3.48)
TYP
0.394
(10.007)
0.152 (3.86)
0.148 (3.76)
0.700 (17.78) BSC
0.079
(2.007) DIA
2 PLACES
0
0
0
1
15
0.063 (1.60)
0.057 (1.45)
0.627
±
0.010
(15.926
±
0.254)
SHORT
LEAD
0.601
±
0.010
(15.265
±
0.254)
LONG
LEAD
0.176 (4.47)
0.150 (3.81)
0.710 (18.03)
0.690 (17.53)
0.200
(5.08)
BSC
0.169
(4.29)
BSC
0.024 (0.61)
0.014 (0.36)
0.031 (0.79)
0.024 (0.60)
0.050 (1.27)
BSC
0.798 (20.27)
0.778 (19.76)
0.182 (4.62)
0.172 (4.37)
SEATING
PLANE