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| 型号： | AD8170ARZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC MUX SWITCHING W/AMP 2:1 8SOIC |
| 标准包装： | 750 |
| 应用： | 带放大器的多路复用器 |
| 电源电压： | ±4 V ~ 6 V |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
AD8170/AD8174
–4–
REV. 0
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8170/AD8174 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
2
AD8170 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.3 Watts
AD8170 8-Lead Small Outline (R) . . . . . . . . . . . 0.9 Watts
AD8174 14-Lead Plastic (N) . . . . . . . . . . . . . . . . 1.6 Watts
AD8174 14-Lead Small Outline (R) . . . . . . . . . . 1.0 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±V
S
Output Short Circuit Duration . . Observe Power Derating Curves
Storage Temperature Range
N & R Packages . . . . . . . . . . . . . . . . . . . . –65
°C to +125°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300
°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2Specification is for device in free air: 8-Pin Plastic Package:
θ
JA = 90°C/Watt;
8-Pin SOIC Package:
θ
JA = 160°C/Watt; 14-Pin Plastic Package: θJA = 90°C/Watt
14-Pin SOIC Package:
θ
JA = 120°C/Watt, where PD = (TJ–TA)/θJA.
ORDERING GUIDE
Temperature
Package
Model
Range
Description
Option
AD8170AN
–40
°C to +85°C 8-Pin Plastic DIP
N-8
AD8170AR
–40
°C to +85°C 8-Pin SOIC
SO-8
AD8170AR-REEL –40
°C to +85°C Reel 8-Pin SOIC
SO-8
AD8174AN
–40
°C to +85°C 14-Pin Plastic DIP
N-14
AD8174AR
–40
°C to +85°C 14-Pin Narrow SOIC R-14
AD8174AR-REEL –40
°C to +85°C Reel 14-Pin SOIC
R-14
AD8170-EB
Evaluation Board For AD8170R
AD8174-EB
Evaluation Board For AD8174R
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8170 and AD8174 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately +150
°C.
Exceeding this limit temporarily may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of +175
°C
for an extended period can result in device failure.
While the AD8170 and AD8174 are internally short circuit
protected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150
°C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to observe
the maximum power derating curves shown in Figures 2 and 3.
MAXIMUM
POWER
DISSIPATION
–
Watts
AMBIENT TEMPERATURE –
°C
2.0
1.5
0
–50
90
–40 –30 –20 –10
0
10
20
30
50
60
70
80
40
1.0
0.5
8-PIN MINI-DIP PACKAGE
8-PIN SOIC PACKAGE
TJ = +150°C
Figure 2. AD8170 Maximum Power Dissipation vs.
Temperature
AMBIENT TEMPERATURE –
°C
2.5
2.0
0.5
–50
90
–40
MAXIMUM
POWER
DISSIPATION
–
Watts
–30 –20 –10
0
10 20
30
40 50
60
80
1.5
1.0
70
14-PIN SOIC
14-PIN DIP PACKAGE
TJ = +150°C
Figure 3. AD8174 Maximum Power Dissipation vs.
Temperature
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD8170ARZ-RL | 功能描述:IC MUX SWITCHING W/AMP 2:1 8SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| AD8170-EB | 制造商:Analog Devices 功能描述:AD8170 EVALUATION BOARD - Bulk |
| AD8174 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:AD8170/AD8174: 250 MHz. 10 ns Switching Multiplexers w/Amplifier Data Sheet (Rev. 0. 10/96) |
| AD8174AN | 制造商:Analog Devices 功能描述:Analog Multiplexer/Amp Single 4:1 14-Pin PDIP Tube 制造商:Rochester Electronics LLC 功能描述:PDIP 200MHZ 4:1 LOW POWER BUFFERED MUX - Bulk 制造商:Analog Devices 功能描述:IC MUX 4CH 250MHZ 8174 DIP14 |
| AD8174ANZ | 功能描述:IC MUX SW W/AMP 250MHZ 14-DIP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
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