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参数资料
| 型号： | AD8189ARUZ-RL |
| 厂商： | ANALOG DEVICES INC |
| 元件分类： | 运动控制电子 |
| 英文描述： | 350 MHz Single-Supply (5 V) Triple 2:1 Multiplexers |
| 中文描述： | TRIPLE 1-CHANNEL, VIDEO MULTIPLEXER, PDSO24 |
| 封装： | LEAD FREE, MO-153AD, TSSOP-24 |
| 文件页数： | 5/24页 |
| 文件大小： | 725K |
| 代理商： | AD8189ARUZ-RL |
AD8188/AD8189
ABSOLUTE MAXIMUM RATINGS
Rev. 0 | Page 5 of 24
Table 2.
Parameter
1
Supply Voltage
DV
CC
to D
GND
DV
CC
to V
EE
V
CC
to D
GND
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, V
REF
SEL A/B, OE
Output Short-Circuit Operation
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering, 10 sec)
Rating
5.5 V
5.5 V
8.0 V
8.0 V
V
EE
≤ V
IN
≤ V
CC
D
GND
≤ V
IN
≤
V
CC
Indefinite
–40°C to +85°C
–65°C to +150°C
300°C
1
Specification is for device in free air (T
A
= 25°C).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
24-Lead TSSOP
1
θ
JA2
85
θ
JC
20
Unit
°C/W
1
Maximum internal power dissipation (PD) should be derated for ambient
temperature (T
A
) such that PD < (150°C T
A
)/θ
JA
.
2
θ
JA
is on a 4-layer board (2s 2p).
MAXIMUM POWER DISSIPATION
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
While the AD8188/AD8189 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figure 3.
2.5
2.0
1.5
1.0
0.5
0
–50 –40 –30 –20 –10
0
10
20
30
40
50
60
70
80
90
M
AMBIENT TEMPERATURE (°C)
0
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
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