参数资料
型号: AD8222-EVALZ
厂商: Analog Devices Inc
文件页数: 21/24页
文件大小: 0K
描述: BOARD EVALUATION FOR AD8222
标准包装: 1
每 IC 通道数: 2 - 双
放大器类型: 仪表
转换速率: 2 V/µs
-3db带宽: 1.2MHz
电流 - 输出 / 通道: 18mA
工作温度: -40°C ~ 85°C
电流供应(主 IC): 900µA
电压 - 电源,单路/双路(±): 4.6 V ~ 36 V,±2.3 V ~ 18 V
板类型: 完全填充
已供物品:
已用 IC / 零件: AD8222
AD8222
Rev. A | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
±18 V
Output Short-Circuit Current Duration
Indefinite
Input Voltage (Common Mode)
±VS
Differential Input Voltage
±VS
Storage Temperature Range
65°C to +130°C
Operational Temperature Range
40°C to +125°C
Package Glass Transition Temperature (TG)
130°C
ESD
Human Body Model
1 kV
Charge Device Model
1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions may affect device reliability.
THERMAL RESISTANCE
Table 6.
Package
θJA
Unit
CP-16-19: LFCSP Without Thermal Pad
86
°C/W
CP-16-13: LFCSP with Thermal Pad
48
°C/W
The θJA values in Table 6 assume a 4-layer JEDEC standard
board. For the LFCSP with thermal pad, it is assumed that the
thermal pad is soldered to a landing on the PCB board, with the
landing thermally connected to a heat dissipating power plane.
θJC at the exposed pad is 4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8222 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
ESD CAUTION
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