参数资料
型号: AD8229HRZ-R7
厂商: Analog Devices Inc
文件页数: 21/24页
文件大小: 0K
描述: IC AMP INST LN 8SOIC
标准包装: 1,000
放大器类型: 仪表
电路数: 1
转换速率: 22 V/µs
-3db带宽: 15MHz
电流 - 输入偏压: 70nA
电压 - 输入偏移: 100µV
电流 - 电源: 6.7mA
电流 - 输出 / 通道: 35mA
电压 - 电源,单路/双路(±): ±4 V ~ 17 V
工作温度: -40°C ~ 175°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
AD8229
Data Sheet
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±17 V
Output Short-Circuit Current Duration
Indefinite
Maximum Voltage at –IN, +IN1
±VS
Differential Input Voltage1
Gain ≤ 4
±VS
4 > Gain > 50
±50 V/gain
Gain ≥ 50
±1 V
Maximum Voltage at REF
±VS
Storage Temperature Range
65°C to +150°C
Specified Temperature Range
SBDIP
40°C to +210°C
SOIC
40°C to +175°C
Maximum Junction Temperature
SBDIP
245°C
SOIC
200°C
ESD
Human Body Model
4 kV
Charge Device Model
1.5 kV
Machine Model
200 V
1
For voltages beyond these limits, use input protection resistors. See the
Theory of Operation section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PREDICTED LIFETIME VS. OPERATING
TEMPERATURE
Comprehensive reliability testing is performed on the AD8229.
Product lifetimes at extended operating temperature are obtained
using high temperature operating life (HTOL). Lifetimes are
predicted from the Arrhenius equation, taking into account
potential design and manufacturing failure mechanism assump-
tions. HTOL is performed to JEDEC JESD22-A108. A minimum
of three wafer fab and assembly lots are processed through
HTOL at the maximum operating temperature. Comprehensive
reliability testing is performed on all Analog Devices, Inc., high
temperature (HT) products.
1
100k
10k
1k
100
10
120
210
200
190
180
170
160
150
140
130
P
R
E
D
IC
TE
D
LIFE
TIM
E
(
H
our
s
)
OPERATING TEMPERATURE (°C)
09412-
200
Figure 3. Predicted Lifetime vs. Operating Temperature
document for the most up-to-date reliability data.
THERMAL RESISTANCE
θJA is specified for a device in free air using a 4-layer JEDEC
printed circuit board (PCB).
Table 3.
Package Type
θJA
Unit
8-Lead SBDIP
100
°C/W
8-Lead SOIC
121
°C/W
ESD CAUTION
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