参数资料
| 型号： | AD822AR |
| 厂商： | Analog Devices Inc |
| 文件页数： | 12/24页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP GP R-R 1.9MHZ LP 8SOIC |
| 设计资源： | 16-Bit Fully Isolated 4 mA to 20 mA Output Module Using AD5662, ADuM1401, and External Amplifiers (CN0064) |
| 标准包装： | 98 |
| 放大器类型： | 通用 |
| 电路数： | 2 |
| 输出类型： | 满摆幅 |
| 转换速率： | 3 V/µs |
| 增益带宽积： | 1.9MHz |
| -3db带宽： | 1.9MHz |
| 电流 - 输入偏压： | 2pA |
| 电压 - 输入偏移： | 400µV |
| 电流 - 电源： | 1.4mA |
| 电流 - 输出 / 通道： | 20mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 36 V，±1.5 V ~ 18 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
AD822
Rev. I | Page 2 of 24
TABLE OF CONTENTS
REVISION HISTORY
1/10—Rev. H to Rev. I
Changes to Features Section and General Description Section . 1
Changes to Endnote 1, Table 1........................................................ 5
Changes to Endnote 1, Table 2........................................................ 7
Changes to Endnote 1, Table 3........................................................ 9
Deleted Table 4; Renumbered Sequentially ................................ 10
Changes to Table 5.......................................................................... 12
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 22
Deleted 3 V, Single-Supply Stereo Headphone Driver Section. 22
Deleted Figure 50; Renumbered Sequentially ............................ 22
8/08—Rev. G to Rev H.
Changes to Features Section and General Description Section . 1
Changed VO to VOUT Throughout................................................... 4
Changes to Table 1............................................................................ 4
Changes to Table 2............................................................................ 6
Changes to Table 3............................................................................ 8
Changes to Table 5.......................................................................... 12
Added Table 6; Renumbered Sequentially .................................. 12
Changes to Figure 13 Caption....................................................... 14
Changes to Figure 29, Figure 31, and Figure 35 ......................... 17
Changes to Figure 36...................................................................... 18
Changed Application Notes Section to Applications
Information Section ....................................................................... 20
Changes to Figure 46 and Figure 47............................................. 21
Changes to Figure 49...................................................................... 22
Changes to Figure 51...................................................................... 23
6/06—Rev. F to Rev. G
Changes to Features ..........................................................................1
Changes to Table 4.......................................................................... 10
Changes to Table 5.......................................................................... 12
Changes to Table 6.......................................................................... 22
10/05—Rev. E to Rev. F
Updated Format..................................................................Universal
Changes to Outline Dimensions .................................................. 24
Updated Ordering Guide .............................................................. 24
1/03—Data sheet changed from Rev. D to Rev. E
Edits to Specifications .......................................................................2
Edits to Figure 10............................................................................ 16
Updated Outline Dimensions....................................................... 17
10/02—Data sheet changed from Rev. C to Rev. D
Edits to Features.................................................................................1
Edits to Ordering Guide ...................................................................6
Updated SOIC Package Outline ................................................... 17
8/02—Data sheet changed from Rev. B to Rev. C
All Figures Updated ................................................................Global
Edits to Features.................................................................................1
Updated All Package Outlines ...................................................... 17
7/01—Data sheet changed from Rev. A to Rev. B
All Figures Updated ................................................................Global
CERDIP References Removed.......................................1, 6, and 18
Additions to Product Description...................................................1
8-Lead SOIC and 8-Lead MSOP Diagrams Added ......................1
Deletion of AD822S Column...........................................................2
Edits to Absolute Maximum Ratings and Ordering Guide .........6
Removed Metallization Photograph ...............................................6
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| AD822AR-3V | 制造商:AD 制造商全称:Analog Devices 功能描述:Single Supply, Rail-to-Rail Low Power FET-Input Op Amp |
| AD822ARM | 制造商:Analog Devices 功能描述:OP AMP DUAL GP R-R O/P 18V/36V 8MSOP - Tape and Reel |
| AD822ARM-R2 | 制造商:Analog Devices 功能描述:OP Amp Dual GP R-R O/P 制造商:Analog Devices 功能描述:IC OP-AMP DUAL SINGLE SUPPLY |
| AD822ARM-REEL | 功能描述:IC OPAMP GP R-R 1.9MHZ LP 8MSOP RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:- 放大器类型:通用 电路数:1 输出类型:满摆幅 转换速率:0.11 V/µs 增益带宽积:350kHz -3db带宽:- 电流 - 输入偏压:4nA 电压 - 输入偏移:20µV 电流 - 电源:260µA 电流 - 输出 / 通道:20mA 电压 - 电源，单路/双路(±):2.7 V ~ 36 V，±1.35 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SO 包装:带卷 (TR) |
| AD822ARMZ | 功能描述:IC OPAMP GP R-R 1.9MHZ LP 8MSOP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:J-FET 电路数:2 输出类型:- 转换速率:13 V/µs 增益带宽积:3MHz -3db带宽:- 电流 - 输入偏压:65pA 电压 - 输入偏移:3000µV 电流 - 电源:1.4mA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-PDIP 包装:管件 |
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