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| 型号： | AD8235ACBZ-P7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | IC AMP INSTR RRIO 23KHZ 11WLCSP |
| 产品变化通告： | 8mm Carrier Tape Changes 28/Feb/2012 |
| 特色产品： | AD8235 Instrumentation Amplifier |
| 标准包装： | 1 |
| 放大器类型： | 仪表 |
| 电路数： | 1 |
| 输出类型： | 满摆幅 |
| 转换速率： | 0.011 V/µs |
| -3db带宽： | 23kHz |
| 电流 - 输入偏压： | 1pA |
| 电压 - 输入偏移： | 2500µV |
| 电流 - 电源： | 30µA |
| 电流 - 输出 / 通道： | 55mA |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V，±0.9 V ~ 2.75 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 11-WFBGA，WLCSP |
| 供应商设备封装： | 11-WLCSP（1.57x2.04） |
| 包装： | 标准包装 |
| 产品目录页面： | 771 (CN2011-ZH PDF) |
| 其它名称： | AD8235ACBZ-P7DKR |
AD8235
Rev. 0 | Page 16 of 20
INCORRECT
Board Thickness
Typical board thicknesses used in the industry range from
0.4 mm to 1.6 mm and are most applicable for the AD8235. The
thickness selected depends on the required robustness of the
populated system assembly. The thinner board results in smaller
shear stress range, creep shear strain range, and creep strain
energy density range in the solder joints under the thermal
loading. Therefore, the thinner build-up board leads to longer
thermal fatigue life of solder joints [John H. Lau and S.W. Ricky
Lee]1
Grounding
The output voltage of the AD8235 is developed with respect to
the potential on the reference terminal, REF. To ensure the most
accurate output, the trace from the REF pin should either be
connected to the AD8235 local ground (see Figure 39) or
connected to a voltage that is referenced to the AD8235 local
ground (Figure 36).
REFERENCE TERMINAL
The reference terminal, REF, is at one end of a 210 kΩ resistor
(see Figure 35). The output of the instrumentation amplifier
is referenced to the voltage on the REF terminal; this is useful
when the output signal needs to be offset to voltages other than
common. For example, a voltage source can be tied to the REF
pin to level-shift the output so that the AD8235 can interface
with an ADC. The allowable reference voltage range is a function
of the gain, common-mode input, and supply voltages. The REF
pin should not exceed either +VS or VS by more than 0.5 V.
For best performance, especially in cases where the output is not
measured with respect to the REF terminal, source impedance to
the REF terminal should be kept low because parasitic resistance
can adversely affect CMRR and gain accuracy. Figure 38
demonstrates how an op amp is configured to provide a low
source impedance to the REF terminal when a midscale
reference voltage is desired.
1John H. Lau and S.W. Ricky Lee, “Effects of Build-Up Printed Circuit Board
Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package
(WLCSP),” IEEE Transactions on Components and Packaging Technologies,
Vol.25, No.1, March 2002, pages 3-14.
V
CORRECT
AD8235
REF
OP AMP
+
–
V
AD8235
REF
08
21
1-
0
36
Figure 38. Driving the REF Pin
POWER SUPPLY REGULATION AND BYPASSING
The AD8235 has high power supply rejection ration (PSRR).
However, for optimal performance, a stable dc voltage should be
used to power the instrumentation amplifier. Noise on the supply
pins can adversely affect performance. As in all linear circuits,
bypass capacitors must be used to decouple the amplifier.
A 0.1 μF capacitor should be placed close to each supply pin.
A 10 μF tantalum capacitor can be used farther away from the
part (see Figure 39). In most cases, it can be shared by other
precision integrated circuits.
AD8235
+VS
+IN
–IN
LOAD
REF
–VS
0.1F
10F
0.1F
10F
SDN
VOUT
08
21
1-
03
7
–VS
Figure 39. Supply Decoupling, REF, and Output Referred to Ground
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