参数资料
型号: AD8264ACPZ-R7
厂商: Analog Devices Inc
文件页数: 37/40页
文件大小: 0K
描述: IC AMP VGA DIFF QUAD LN 40LFCSP
标准包装: 750
放大器类型: 可变增益
电路数: 4
输出类型: 差分
转换速率: 380 V/µs
-3db带宽: 235MHz
电流 - 输入偏压: 5µA
电流 - 电源: 99mA
电压 - 电源,单路/双路(±): ±2.5 V ~ 5 V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 40-VFQFN 裸露焊盘,CSP
供应商设备封装: 40-LFCSP-VQ(6x6)
包装: 带卷 (TR)
AD8264
Rev. A | Page 6 of 40
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Voltage
Supply Voltage (VPOS, VNEG)
±6 V
Input Voltage (INPx)
VPOS, VNEG
Gain Voltage (GNHx, GNLO)
VPOS, VNEG
Power Dissipation
2.5 W
Temperature
Operating Temperature Range
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
Package Glass Transition Temperature (T
G)
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. The θJA
values in Table 3 assume a 4-layer JEDEC standard board with
zero airflow.
Table 3. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
40-Lead LFCSP1
31.0
2.3
°C/W
1 4-Layer JEDEC board (2S2P).
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8264 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 150°C, which is the glass transition temperature,
the properties of the plastic change. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 150°C for an
extended period can cause changes in silicon devices, potentially
resulting in a loss of functionality.
ESD CAUTION
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