参数资料
型号: AD8337-EVALZ
厂商: Analog Devices Inc
文件页数: 18/32页
文件大小: 0K
描述: BOARD EVALUATION FOR AD8337
标准包装: 1
系列: X-AMP®
每 IC 通道数: 1 - 单
放大器类型: 电压反馈
输出类型: 单端
转换速率: 625 V/µs
-3db带宽: 280MHz
工作温度: -40°C ~ 85°C
电流供应(主 IC): 18.5mA
电压 - 电源,单路/双路(±): ±2.5 V ~ 5 V
板类型: 完全填充
已供物品:
已用 IC / 零件: AD8337
产品目录页面: 775 (CN2011-ZH PDF)
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AD8337BCPZ-WP-ND - IC AMP VGA DC-COUPLED GP 8-LFCSP
AD8337BCPZ-R2DKR-ND - IC AMP VGA LOW NOISE 8-LFCSP
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AD8337
Rev. C | Page 25 of
32
POWER SUPPLY
+5V
TOP:
SIGNAL GENERATOR 10.05MHz, 500mV p-p
BOTTOM:
SIGNAL GENERATOR 9.95MHz, 500mV p-p
SIGNAL
INPUT
–5V
POWER
SPLITTER
PREAMP
OUTPUT
VGAIN
POWER
AMPLIFIERS
SPECTRUM
ANALYZER
05
57
5-
1
83
Figure 83. Typical Board Test Connections
MEASUREMENT SETUP
Figure 83 shows board connections for two generators. In this
example, the experiment illustrates IMD measurements using
standard off-the-shelf test equipment used by Analog Devices.
However, any equivalent equipment can be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
ground planes. Figure 84 through Figure 88 show the copper
layouts.
For ease of assembly, all board components are located on the
primary side and are 0603 size surface mounts. Higher density
applications may require components on both sides of the board
and present no problem to the AD8337, as demonstrated in
unreleased versions of the board that featured secondary-side
components and vias. Not evident in the figures are thermal
vias within the pad that solder to the mating pad of the AD8337
chip-scale package. These vias serve as a thermal path and are
the primary means of removing heat from the device. The thermal
specifications for the AD8337 are predicated on the use of multi-
layer board construction with these thermal vias to enable heat
conductivity from the die.
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