参数资料
型号: AD8651ARMZ-R2
厂商: Analog Devices Inc
文件页数: 16/20页
文件大小: 0K
描述: IC OPAMP VF CMOS 50MHZ LN 8MSOP
标准包装: 1
系列: DigiTrim®
放大器类型: 电压反馈
电路数: 1
输出类型: 满摆幅
转换速率: 41 V/µs
增益带宽积: 50MHz
电流 - 输入偏压: 1pA
电压 - 输入偏移: 100µV
电流 - 电源: 9.5mA
电流 - 输出 / 通道: 40mA
电压 - 电源,单路/双路(±): 2.7 V ~ 5.5 V,±1.35 V ~ 2.75 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 标准包装
其它名称: AD8651ARMZ-R2DKR
Data Sheet
AD8651/AD8652
Rev. D | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
Supply Voltage
6.0 V
Input Voltage
GND to VS + 0.3 V
Differential Input Voltage
±6.0 V
Output Short-Circuit Duration to GND
Indefinite
Electrostatic Discharge (HBM)
4000 V
Storage Temperature Range
RM, R Package
65°C to +150°C
Operating Temperature Range
40°C to +125°C
Junction Temperature Range
RM, R Package
65°C to +150°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead MSOP (RM)
210
45
°C/W
8-Lead SOIC_N (R)
158
43
°C/W
相关PDF资料
PDF描述
0001.2516.PT FUSE 16A 250V 5X20 T-LAG CERM
RGH1608-2C-P-911-B RES 910 OHM 1/6W 0.1% 0603 SMD
0001.2508.PT FUSE 2.5A 250V 5X20 T-LAG CERM
RGH1608-2C-P-821-B RES 820 OHM 1/6W 0.1% 0603 SMD
0001.2514.PT FUSE 10A 250V 5X20 T-LAG CERM
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