参数资料
型号: AD8663ARZ-REEL7
厂商: Analog Devices Inc
文件页数: 12/16页
文件大小: 0K
描述: IC OPAMP GP R-R CMOS LN 8SOIC
标准包装: 1,000
系列: DigiTrim®
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 0.3 V/µs
增益带宽积: 540kHz
电流 - 输入偏压: 0.3pA
电压 - 输入偏移: 40µV
电流 - 电源: 230µA
电流 - 输出 / 通道: 50mA
电压 - 电源,单路/双路(±): 5 V ~ 16 V,±2.5 V ~ 8 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
Data Sheet
AD8663/AD8667/AD8669
Rev. C | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
18 V
Input Voltage
0.1 V to VSY
Differential Input Voltage
18 V
Output Short-Circuit Duration to GND
Indefinite
Storage Temperature Range
60°C to +150°C
Operating Temperature Range
40°C to +125°C
Junction Temperature Range
65°C to +150°C
Lead Temperature, Soldering (60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead SOIC (R-8)
121
43
°C/W
8-Lead LFCSP (CP-8-2)
751
°C/W
8-Lead MSOP (RM-8)
145
45
°C/W
14-Lead SOIC (R-14)
90
45
°C/W
14-Lead TSSOP (RU-14)
180
35
°C/W
1
Exposed pad soldered to application board.
ESD CAUTION
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