参数资料
型号: AD8674ARZ
厂商: Analog Devices Inc
文件页数: 16/20页
文件大小: 0K
描述: IC OPAMP GP 10MHZ QUAD LN 14SOIC
产品变化通告: AD8674 Datasheet Specification Change 25/Nov/2009
标准包装: 56
放大器类型: 通用
电路数: 4
转换速率: 4 V/µs
增益带宽积: 10MHz
电流 - 输入偏压: 3nA
电压 - 输入偏移: 20µV
电流 - 电源: 3mA
电流 - 输出 / 通道: 20mA
电压 - 电源,单路/双路(±): 10 V ~ 36 V,±5 V ~ 18 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
供应商设备封装: 14-SOIC
包装: 管件
产品目录页面: 772 (CN2011-ZH PDF)
Data Sheet
AD8671/AD8672/AD8674
Rev. F | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.1
Parameter
Rating
Supply Voltage
36 V
Input Voltage
VS– to VS+
Differential Input Voltage
±0.7 V
Output Short-Circuit Duration
Indefinite
Storage Temperature Range
All Packages
–65°C to +150°C
Operating Temperature Range
8-Lead Packages
–40°C to +125°C
14-Lead Packages
–40°C to +85°C
Junction Temperature Range
All Packages
–65°C to +150°C
Lead Temperature Range (Soldering, 60 sec)
300°C
1
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
See the Applications section for a related discussion on power.
Table 5. Package Characteristics
Package Type
θJA1
θJC
Unit
8-Lead MSOP (RM)
142
44
°C/W
8-Lead SOIC_N (R)
120
43
°C/W
14-Lead SOIC_N (R)
90
36
°C/W
14-Lead TSSOP (RU)
112
35
°C/W
1
θJA is specified for the worst-case conditions, that is., θJA is specified for the
device soldered on a 4-layer circuit board for surface-mount packages.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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