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| 型号： | AD9235BRUZRL7-65 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 31/40页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT SGL 65MSPS 28TSSOP |
| 标准包装： | 1,000 |
| 位数： | 12 |
| 采样率（每秒）： | 65M |
| 数据接口： | 并联 |
| 转换器数目： | 3 |
| 功率耗散（最大）： | 300mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 2 个单端，单极；1 个差分，单极 |
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Data Sheet
AD9235
Rev. D | Page 37 of 40
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Package Option
AD9235BRU-20
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRURL7-20
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRUZ-20
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRUZRL7-20
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRU-40
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRURL7-40
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRUZ-40
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRUZRL7-40
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRU-65
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRURL7-65
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRUZ-65
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BRUZRL7-65
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD9235BCPZ-20
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
AD9235BCPZRL7-20
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
AD9235BCPZ-40
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
AD9235BCPZRL7-40
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
AD9235BCPZ-65
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
AD9235BCPZRL7-65
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
CP-32-7
1
Z = RoHS Compliant Part.
2
It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.
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相关代理商/技术参数 |
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|---|---|
| AD9235XCP-65 | 制造商:Analog Devices 功能描述:12-BIT 3V 20 MSPS ADC - Bulk |
| AD9236 | 制造商:AD 制造商全称:Analog Devices 功能描述:12-Bit, 80 MSPS, 3 V A/D Converter |
| AD9236BCP-80 | 制造商:Analog Devices 功能描述:ADC Single Pipelined 80Msps 12-bit Parallel 32-Pin LFCSP EP 制造商:Analog Devices 功能描述:IC 12BIT ADC 3V 80MSPS SMD 9236 |
| AD9236BCP-80EB | 制造商:Analog Devices 功能描述:Evaluation Board For 12-Bit, 80 MSPS, 3 V A/D Converter 制造商:Analog Devices 功能描述:EVAL BD FOR 12-BIT, 80 MSPS, 3V A/D CNVRTR - Bulk |
| AD9236BCPRL7-80 | 制造商:Analog Devices 功能描述:ADC Single Pipelined 80Msps 12-bit Parallel 32-Pin LFCSP EP T/R |
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