参数资料
型号: AD9238BCPZRL-65
厂商: Analog Devices Inc
文件页数: 39/48页
文件大小: 0K
描述: IC ADC 12BIT DUAL 65MSPS 64LFCSP
标准包装: 2,500
位数: 12
采样率(每秒): 65M
数据接口: 并联
转换器数目: 2
功率耗散(最大): 600mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 带卷 (TR)
输入数目和类型: 4 个单端,单极;2 个差分,单极
配用: AD9238BCP-65EBZ-ND - BOARD EVAL WITH AD9238BCP-65
AD9238
Rev. C | Page 44 of 48
02640-
077
Figure 58. PCB Bottom-Side Silkscreen
02640-
078
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when locally
attached to a ground plane at the PCB. A thermal (filled) via array
to a ground plane beneath the part provides a path for heat to
escape the package, lowering junction temperature. Improved
electrical performance also results from the reduction in package
parasitics due to proximity of the ground plane. Recommended
array is 0.3 mm vias on 1.2 mm pitch. θJA = 26.4°C/W with this
recommended configuration. Soldering the slug to the PCB is a
requirement for this package.
Figure 59. Thermal Via Array
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