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| 型号： | ADA4310-1ARHZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP CF DUAL LDIST 10MSOP |
| 标准包装： | 1,000 |
| 放大器类型： | 电流反馈 |
| 电路数： | 2 |
| 转换速率： | 820 V/µs |
| -3db带宽： | 190MHz |
| 电流 - 输入偏压： | 6µA |
| 电压 - 输入偏移： | 1000µV |
| 电流 - 电源： | 7.6mA |
| 电压 - 电源，单路/双路(±)： | 5 V ~ 12 V，±2.5 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
ADA4310-1
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
10-Lead MINI_SO_EP
12 V
16-Lead LFCSP_VQ
±6V
Power Dissipation
(TJMAX TA)/θJA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for device soldered in circuit board for surface-mount
packages.
Table 3.
Package Type
θJA
Unit
10-Lead MINI_SO_EP
44
°C/W
16-Lead LFCSP_VQ
63
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead
MINI_SO_EP (44°C/W) and for the 16-lead LFCSP_VQ
(63°C/W) on a JEDEC standard 4-layer board. θJA values are
approximations.
AMBIENT TEMPERATURE (°C)
M
A
X
IM
UM
P
O
W
E
R
DI
S
IP
AT
IO
N
(
W
)
06
02
7-
01
6
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–35
–15
5
25
45
65
85
LFCSP_VQ-16
MINI_SO_EP-10
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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