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参数资料
| 型号： | ADA4311-1ARHZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | IC LINE DRVR DUAL HI CURR 10MSOP |
| 标准包装： | 3,000 |
| 放大器类型： | 电流反馈 |
| 电路数： | 2 |
| 转换速率： | 1050 V/µs |
| -3db带宽： | 310MHz |
| 电流 - 输入偏压： | 4.5µA |
| 电压 - 输入偏移： | 1000µV |
| 电流 - 电源： | 11.8mA |
| 电压 - 电源，单路/双路(±)： | 6 V ~ 12 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
ADA4311-1
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
13.6 V
Power Dissipation
(TJMAX TA)/θJA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
Thermal resistance (θJA) is specified for the worst-case conditions,
that is, θJA is specified for device soldered in circuit board for
surface-mount packages.
Table 3.
Package Type
θJA
Unit
10-Lead MINI_SO_EP
44
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4311-1 is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 3 shows the maximum safe power dissipation in
the package vs. the ambient temperature for the 10-lead
MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board.
θJA values are approximations.
AMBIENT TEMPERATURE (°C)
M
A
X
IM
UM
P
O
W
E
R
DI
S
IP
AT
IO
N
(
W
)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–35
–15
5
25
45
65
85
MINI_SO_EP-10
06
94
0-
00
3
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4311-1ARHZ-RL1 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Cost, Dual, High Current Output Line Driver with Shutdown |
| ADA4312-1ACPZ-R2 | 制造商:Analog Devices 功能描述:HIGH BANDWIDTH POWER LINE DRIVER - Tape and Reel |
| ADA4312-1ACPZ-R7 | 功能描述:缓冲器和线路驱动器 High Bandwidth Power Line Driver RoHS:否 制造商:Intersil 输入线路数量: 输出线路数量: 极性: 电源电压-最大: 电源电压-最小: 最大工作温度:+ 85 C 安装风格: 封装 / 箱体:QFN EP 封装:Reel |
| ADA4312-1ACPZ-RL | 功能描述:缓冲器和线路驱动器 WB Diff Hi Out Crnt Line Dvr w/ Shutdown RoHS:否 制造商:Intersil 输入线路数量: 输出线路数量: 极性: 电源电压-最大: 电源电压-最小: 最大工作温度:+ 85 C 安装风格: 封装 / 箱体:QFN EP 封装:Reel |
| ADA4320-1 | 制造商:AD 制造商全称:Analog Devices 功能描述:High Power, Low Distortion Upstream |
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