参数资料
| 型号： | ADA4320-1ACPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC LINE DVR CATV 5V 24LFCSP |
| 标准包装： | 5,000 |
| 应用： | CATV |
| 输出类型： | 差分 |
| 电路数： | 1 |
| 电流 - 电源： | 260mA |
| 电压 - 电源，单路/双路(±)： | 4.75 V ~ 5.25 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 24-LFCSP-VQ EP（4x5） |
| 包装： | 带卷 (TR) |
ADA4320-1
Rev. A | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
MAXIMUM POWER DISSIPATION
Table 4.
Parameter
Rating
Supply Voltage
5.5 V
Maximum Power Dissipation
1.65 W
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
The maximum safe power dissipation in the ADA4320-1 package
is limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that
the package exerts on the die, permanently shifting the parametric
performance of the ADA4320-1. Exceeding a junction temperature
of 150°C for an extended time can result in changes in the silicon
devices, potentially causing failure.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through-holes, ground, and power planes,
reduces the θJA. The exposed paddle on the underside of the
package must be soldered to a pad on the PCB surface that is
thermally connected to a copper plane to achieve the specified θJA.
THERMAL RESISTANCE
θJA is specified for the device soldered to a high thermal
conductivity 4-layer (2s2p) circuit board, as described in
EIA/JESD 51-7.
ESD CAUTION
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
24-lead LFCSP
31.2
5.7
°C/W
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