参数资料
型号: ADA4692-4ARUZ-RL
厂商: Analog Devices Inc
文件页数: 9/20页
文件大小: 0K
描述: IC OPAMP GP R-R 3.6MHZ 14TSSOP
标准包装: 2,500
放大器类型: 电压反馈
电路数: 4
输出类型: 满摆幅
转换速率: 1.3 V/µs
增益带宽积: 3.6MHz
电流 - 输入偏压: 0.5pA
电压 - 输入偏移: 500µV
电流 - 电源: 180µA
电流 - 输出 / 通道: 55mA
电压 - 电源,单路/双路(±): 2.7 V ~ 5.5 V,±1.35 V ~ 2.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 14-TSSOP
包装: 带卷 (TR)
ADA4691-2/ADA4691-4/ADA4692-2/ADA4692-4
Rev. C | Page 17 of 20
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.23
0.18
1.75
1.60 SQ
1.55
0702
09-C
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Figure 62. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
091709-A
1.250
1.210
1.170
0.645
0.600
0.555
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
1
2
3
B
C
0.230
0.200
0.170
0.287
0.267
0.247
SEATING
PLANE
0.415
0.400
0.385
BALL A1
IDENTIFIER
1.260
1.220
1.180
0.05 NOM
COPLANARITY
0.40
BSC
Figure 63. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9-3)
Dimensions shown in millimeters
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