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| 型号： | ADA4851-1WYRJZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 3/25页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP VF R-R LP 125MA SOT23-6 |
| 标准包装： | 1 |
| 放大器类型： | 电压反馈 |
| 电路数： | 1 |
| 输出类型： | 满摆幅 |
| 转换速率： | 375 V/µs |
| -3db带宽： | 105MHz |
| 电流 - 输入偏压： | 2.2µA |
| 电压 - 输入偏移： | 600µV |
| 电流 - 电源： | 2.9mA |
| 电流 - 输出 / 通道： | 83mA |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 12 V，±1.35 V ~ 6 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-23-6 |
| 包装： | 标准包装 |
| 其它名称： | ADA4851-1WYRJZ-R7DKR |
ADA4851-1/ADA4851-2/ADA4851-4
Rev. J | Page 10 of 24
ABSOLUTE MAXIMUM RATINGS
PD = Quiescent Power + (Total Drive Power Load Power)
Table 4.
Parameter
Rating
Supply Voltage
12.6 V
Power Dissipation
See Figure 5
Common-Mode Input Voltage
VS 0.5 V to +VS + 0.5 V
Differential Input Voltage
+VS to VS
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +125°C
Lead Temperature
JEDEC J-STD-20
Junction Temperature
150°C
()
L
OUT
L
OUT
S
D
R
V
R
V
I
V
P
2
–
2
×
+
×
=
RMS output voltages should be considered. If RL is referenced
to VS, as in single-supply operation, the total drive power is
VS × IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS/4 for RL to midsupply.
() (
)
L
S
D
R
V
I
V
P
2
4
/
+
×
=
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
In single-supply operation with RL referenced to VS, the worst
case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
In addition, more metal directly in contact with the package
leads and through holes under the device reduces θJA.
Figure 5 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SOT-23
(170°C/W), the 8-lead MSOP (150°C/W), and the 14-lead
TSSOP (120°C/W) on a JEDEC standard 4-layer board. θJA
values are approximations.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions; that is, θJA is specified
for device soldered in circuit board for surface-mount packages.
0
2.0
–55
125
MAXI
MUM
PO
W
E
R
DI
SSI
PAT
IO
N
(W
)
05143-057
AMBIENT TEMPERATURE (
°C)
1.5
1.0
0.5
–45 –35 –25 –15 –5
5
15253545 55657585 95 105 115
SOT-23-6
TSSOP
MSOP
Table 5. Thermal Resistance
Package Type
θJA
Unit
6-lead SOT-23
170
°C/W
8-lead MSOP
150
°C/W
14-lead TSSOP
120
°C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4851-1/
ADA4851-2/ADA4851-4 is limited by the associated rise in
junction temperature (TJ) on the die. At approximately 150°C,
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
amplifiers. Exceeding a junction temperature of 150°C for an
extended period can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the die
due to the drive of the amplifier at the output. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS).
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