参数资料
| 型号： | ADA4896-2ARMZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 29/29页 |
| 文件大小： | 0K |
| 描述： | IC OP AMP LOW NOISE 8-MSOP |
| 特色产品： | Rail-to-Rail Input/Output Amplifiers |
| 标准包装： | 50 |
| 放大器类型： | 电压反馈 |
| 电路数： | 2 |
| 输出类型： | 满摆幅 |
| 转换速率： | 120 V/µs |
| -3db带宽： | 230MHz |
| 电流 - 输入偏压： | 11µA |
| 电压 - 输入偏移： | 28µV |
| 电流 - 电源： | 3mA |
| 电流 - 输出 / 通道： | 80mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 10 V，±1.5 V ~ 5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 管件 |
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ADA4896-2/ADA4897-1/ADA4897-2
Data Sheet
Rev. B | Page 8 of 28
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Supply Voltage
11 V
Power Dissipation
See Figure 3
Common-Mode Input Voltage
VS 0.7 V to +VS + 0.7 V
Differential Input Voltage
0.7 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +125°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in a circuit board for surface-
Table 7. Thermal Resistance
Package Type
θJA
Unit
8-Lead Dual MSOP (ADA4896-2)
222
°C/W
8-Lead Dual LFCSP (ADA4896-2)
61
°C/W
8-Lead Single SOIC (ADA4897-1)
133
°C/W
6-Lead Single SOT-23 (ADA4897-1)
150
°C/W
10-Lead Dual MSOP (ADA4897-2)
210
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4896-2/
ADA4897-1/ADA4897-2 is limited by the associated rise in
junction temperature (TJ) on the die. At approximately 150C,
which is the glass transition temperature, the properties of the
plastic change. Even temporarily exceeding this temperature
limit may change the stresses that the package exerts on the
die, permanently shifting the parametric performance of the
temperature of 175C for an extended period of time can result
in changes in silicon devices, potentially causing degradation or
loss of functionality.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
the output.
The quiescent power dissipation is the voltage between the supply
pins (±VS) multiplied by the quiescent current (IS).
PD = Quiescent Power + (Total Drive Power Load Power)
L
OUT
L
OUT
S
D
R
V
R
V
I
V
P
2
RMS output voltages should be considered. If RL is referenced to
VS, as in single-supply operation, the total drive power is VS ×
IOUT. If the rms signal levels are indeterminate, consider the worst
case, when VOUT = VS/4 for RL to midsupply.
L
S
D
R
V
I
V
P
2
4
/
In single-supply operation with RL referenced to VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
Also, more metal directly in contact with the package leads
and exposed paddle from metal traces, through holes, ground,
and power planes reduces θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature on a JEDEC standard
4-layer board. θJA values are approximations.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
–45 –35 –25 –15 –5
5
15
25
35
45
55
65
75
85
95 105 115 125
MA
XI
MU
M
PO
W
E
R
D
ISSI
P
A
TI
ON
(
W
)
AMBIENT TEMPERATURE (°C)
8-LEAD SOIC
8-LEAD LFCSP
TJ = 150°C
094
47-
053
8-LEAD MSOP
6-LEAD SOT-23
10-LEAD MSOP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
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相关代理商/技术参数 |
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| ADA4896-2ARMZ_PROMO | 制造商:Analog Devices 功能描述:IC OP AMP R/R LOW POWER MS |
| ADA4896-2ARMZ-R7 | 功能描述:IC OPAMP GP R-R 50MHZ LP 8MSOP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:73 系列:Over-The-Top® 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:0.07 V/µs 增益带宽积:200kHz -3db带宽:- 电流 - 输入偏压:1nA 电压 - 输入偏移:285µV 电流 - 电源:50µA 电流 - 输出 / 通道:25mA 电压 - 电源，单路/双路(±):2 V ~ 44 V，±1 V ~ 22 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-WFDFN 裸露焊盘 供应商设备封装:16-DFN-EP（5x3） 包装:管件 |
| ADA4896-2ARMZ-RL | 制造商:AD 制造商全称:Analog Devices 功能描述:1 nV/√Hz, Low Power |
| ADA4897-1 | 制造商:AD 制造商全称:Analog Devices 功能描述:1 nV/√Hz, Low Power |
| ADA4897-1AR-EBZ | 功能描述:BOARD EVAL FOR ADA4897 SOIC RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
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