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参数资料
| 型号： | ADA4927-2YCPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP CF DIFF DUAL LN 24LFCSP |
| 标准包装： | 5,000 |
| 放大器类型： | 电流反馈 |
| 电路数： | 2 |
| 输出类型： | 差分 |
| 转换速率： | 5000 V/µs |
| -3db带宽： | 2.3GHz |
| 电流 - 输入偏压： | 500nA |
| 电压 - 输入偏移： | 300µV |
| 电流 - 电源： | 20mA |
| 电流 - 输出 / 通道： | 65mA |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 11 V，±2.25 V ~ 5.5 V |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 24-LFCSP-VQ（4x4） |
| 包装： | 带卷 (TR) |
ADA4927-1/ADA4927-2
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (VS) times the quiescent current (IS).
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Table 7.
Parameter
Rating
Supply Voltage
11 V
Power Dissipation
See Figure 4
Input Currents +IN, IN, PD
±5 mA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +105°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, throughholes, ground, and power
planes reduces θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 4 shows the maximum safe power dissipation in the package
vs. the ambient temperature for the single 16-lead LFCSP (87°C/W)
and the dual 24-lead LFCSP (47°C/W) on a JEDEC standard
4-layer board with the exposed pad soldered to a PCB pad that
is connected to a solid plane.
THERMAL RESISTANCE
θJA is specified for the device (including exposed pad) soldered
to a high thermal conductivity 2s2p circuit board, as described
in EIA/JESD 51-7.
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–40
–20
0
20
40
AMBIENT TEMPERATURE (°C)
60
80
100
MA
XIMU
M
P
O
WER
D
ISS
IPA
T
IO
N
(W
)
07
57
4-
0
03
Table 8.
Package Type
θJA
Unit
ADA4927-2
16-Lead LFCSP (Exposed Pad)
87
°C/W
24-Lead LFCSP (Exposed Pad)
47
°C/W
ADA4927-1
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4927 package
is limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4927. Exceeding a junction temperature
of 150°C for an extended period can result in changes in the
silicon devices, potentially causing failure.
Figure 4. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
ESD CAUTION
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