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参数资料
| 型号： | ADA4939-2YCP-EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 15/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADA4939-2YCP |
| 标准包装： | 1 |
| 每 IC 通道数： | 2 - 双 |
| 放大器类型： | 差分 |
| 板类型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 24-LFCSP 封装 |
ADA4939-1/ADA4939-2
Rev. 0 | Page 22 of 24
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4939 is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design. This section shows a detailed example of how the
ADA4939-1 was addressed.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4939-1 as possible.
However, the area near the feedback resistors (RF), gain resistors
(RG), and the input summing nodes (Pin 2 and Pin 3) should be
cleared of all ground and power planes (see Figure 51). Clearing
the ground and power planes minimizes any stray capacitance at
these nodes and prevents peaking of the response of the amplifier
at high frequencies.
The thermal resistance, θJA, is specified for the device, including
the exposed pad, soldered to a high thermal conductivity four-layer
circuit board, as described in EIA/JESD 51-7.
0
74
29
-0
58
Figure 51. Ground and Power Plane Voiding in Vicinity of RF and RG
The power supply pins should be bypassed as close to the device
as possible and directly to a nearby ground plane. High frequency
ceramic chip capacitors should be used. It is recommended that
two parallel bypass capacitors (1000 pF and 0.1 μF) be used for
each supply. The 1000 pF capacitor should be placed closer to
the device. Further away, low frequency bypassing should be
provided, using 10 μF tantalum capacitors from each supply
to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, a symmetrical
layout should be provided to maximize balanced performance.
When routing differential signals over a long distance, PCB
traces should be close together, and any differential wiring
should be twisted such that loop area is minimized. Doing this
reduces radiated energy and makes the circuit less susceptible
to interference.
1.30
0.80
1.30
07
42
9-
0
59
Figure 52. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07
42
9-
06
0
Figure 53. Cross-Section of Four-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4939-2YCPZ-R2 | 制造商:Analog Devices 功能描述:SP AMP DIFFERENTIAL ADC DRVR DUAL 5.25V 24LFCSP - Tape and Reel 制造商:Rochester Electronics LLC 功能描述: |
| ADA4939-2YCPZ-R7 | 功能描述:IC AMP DIFF DUAL ULDIST 24LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:Excalibur™ 放大器类型:J-FET 电路数:1 输出类型:- 转换速率:45 V/µs 增益带宽积:10MHz -3db带宽:- 电流 - 输入偏压:20pA 电压 - 输入偏移:490µV 电流 - 电源:1.7mA 电流 - 输出 / 通道:48mA 电压 - 电源，单路/双路(±):4.5 V ~ 38 V，±2.25 V ~ 19 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| ADA4939-2YCPZ-RL | 功能描述:IC AMP DIFF DUAL ULDIST 24LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:Excalibur™ 放大器类型:J-FET 电路数:1 输出类型:- 转换速率:45 V/µs 增益带宽积:10MHz -3db带宽:- 电流 - 输入偏压:20pA 电压 - 输入偏移:490µV 电流 - 电源:1.7mA 电流 - 输出 / 通道:48mA 电压 - 电源，单路/双路(±):4.5 V ~ 38 V，±2.25 V ~ 19 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| ADA494 | 制造商:AD 制造商全称:Analog Devices 功能描述:16-Bit, 1 MSPS PulSAR ADC in MSOP QFN |
| ADA4940-1 | 制造商:AD 制造商全称:Analog Devices 功能描述:Ultralow Power, Low Distortion |
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