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| 型号： | ADA4940-1ACPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/33页 |
| 文件大小： | 0K |
| 描述： | IC DIFF ADC DVR 18BIT LN 16LFCSP |
| 标准包装： | 5,000 |
| 放大器类型： | 差分 |
| 电路数： | 1 |
| 输出类型： | 差分 |
| 转换速率： | 95 V/µs |
| -3db带宽： | 260MHz |
| 电流 - 输入偏压： | 1.1µA |
| 电压 - 输入偏移： | 60µV |
| 电流 - 电源： | 1.25mA |
| 电流 - 输出 / 通道： | 46mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 7 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ EP（3x3） |
| 包装： | 带卷 (TR) |
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ADA4940-1/ADA4940-2
Data Sheet
Rev. C | Page 28 of 32
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4940-1/ADA4940-2 are
sensitive to the PCB environment in which they operate.
Realizing their superior performance requires attention to
the details of high speed PCB design.
ADA4940-1 LFCSP EXAMPLE
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4940-1 as possible.
However, clear the area near the feedback resistors (RF), gain
resistors (RG), and the input summing nodes (Pin 2 and Pin 3)
of all ground and power planes (see Figure 74). Clearing the
ground and power planes minimizes any stray capacitance at
these nodes and prevents peaking of the response of the
amplifier at high frequencies.
The thermal resistance, θJA, is specified for the device, including
the exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD 51-7.
0
84
52
-08
6
Figure 74. Ground and Power Plane Voiding in Vicinity of RF and RG
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency ceramic
chip capacitors. Use two parallel bypass capacitors (1000 pF and
0.1 μF) for each supply. Place the 1000 pF capacitor closer to the
device. Further away, provide low frequency bypassing using
10 μF tantalum capacitors from each supply to ground.
Ensure that signal routing is short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a
symmetrical layout to maximize balanced performance. When
routing differential signals over a long distance, ensure that
PCB traces are close together, and twist any differential wiring
such that loop area is minimized. Doing this reduces radiated
energy and makes the circuit less susceptible to interference.
1.30
0.80
1.30
08
45
2-
08
7
Figure 75. Recommended PCB Thermal Attach Pad Dimensions (mm)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
0
845
2-
0
88
Figure 76. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in mm)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4940-1AR-EBZ | 制造商:AD 制造商全称:Analog Devices 功能描述:Ultralow Power, Low Distortion |
| ADA4940-1ARZ | 功能描述:IC DIFF ADC DVR 18BIT LN 8SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:1 系列:- 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:0.028 V/µs 增益带宽积:105kHz -3db带宽:- 电流 - 输入偏压:3nA 电压 - 输入偏移:100µV 电流 - 电源:3.3µA 电流 - 输出 / 通道:12mA 电压 - 电源，单路/双路(±):2.7 V ~ 12 V，±1.35 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:剪切带 (CT) 其它名称:OP481GRUZ-REELCT |
| ADA4940-1ARZ_PROMO | 制造商:Analog Devices 功能描述:ADC 260MHZ 16BIT 3-7VIN SO |
| ADA4940-1ARZ-R7 | 功能描述:IC DIFF ADC DVR 18BIT LN 8SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:通用 电路数:2 输出类型:满摆幅 转换速率:1.8 V/µs 增益带宽积:6.5MHz -3db带宽:4.5MHz 电流 - 输入偏压:5nA 电压 - 输入偏移:100µV 电流 - 电源:65µA 电流 - 输出 / 通道:35mA 电压 - 电源，单路/双路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| ADA4940-1ARZ-RL | 功能描述:IC DIFF ADC DVR 18BIT LN 8SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:通用 电路数:2 输出类型:满摆幅 转换速率:1.8 V/µs 增益带宽积:6.5MHz -3db带宽:4.5MHz 电流 - 输入偏压:5nA 电压 - 输入偏移:100µV 电流 - 电源:65µA 电流 - 输出 / 通道:35mA 电压 - 电源，单路/双路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
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