参数资料
| 型号： | ADA4960-1ACPZ-R2 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 10/20页 |
| 文件大小： | 0K |
| 描述： | IC ADC DRIVER DIFF 16LFCSP |
| 标准包装： | 1 |
| 类型： | ADC 驱动器 |
| 应用： | 数据采集 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-WQ（3x3） |
| 包装： | 标准包装 |
| 其它名称： | ADA4960-1ACPZ-R2DKR |
ADA4960-1
Rev. 0 | Page 18 of 20
LAYOUT, GROUNDING, AND BYPASSING
The ADA4960-1 is a high speed device. Realizing its superior
performance requires attention to the details of high speed
printed circuit board (PCB) design.
The first requirement is to use a multilayer PCB with solid ground
and power planes that cover as much of the board area as possible.
Bypass each power supply pin directly to a nearby ground plane, as
close to the device as possible. Use 0.1 μF high frequency ceramic
chip capacitors.
Provide low frequency bulk bypassing, using 10 μF tantalum
capacitors from each supply to ground.
Stray transmission line capacitance in combination with package
parasitics can potentially form a resonant circuit at high frequencies,
resulting in excessive gain peaking or possible oscillation.
Signal routing should be short and direct to avoid such parasitic
effects. Provide symmetrical layout for complementary signals
to maximize balanced performance.
Use radio frequency transmission lines to connect the driver
and receiver to the amplifier.
Minimize stray capacitance at the input/output pins by clearing
the underlying ground and low impedance planes near these pins.
If the driver/receiver is more than one-eighth of the wavelength
from the amplifier, the signal trace widths should be minimal.
This nontransmission line configuration requires the underlying
and adjacent ground and low impedance planes to be cleared
near the signal lines.
The exposed thermal paddle is internally connected to the ground
pin of the amplifier. Solder the paddle to the low impedance
ground plane on the PCB to ensure the specified electrical
performance and to provide thermal relief. To reduce thermal
impedance further, it is recommended that the ground planes
on all layers under the paddle be connected together with vias.
08
45
8-
03
6
0.3mm DIAMETER VIAS
1.2mm
1.5mm
1.
2m
m
1.
5m
m
Figure 44. Recommended PCB Thermal Attach Pad
TOP METAL
GROUND PLANE
POWER PLANE
BOTTOM METAL
1.5mm
1.2mm
08
45
8-
03
7
Figure 45. Cross-Section of a 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4960-1ACPZ-R7 | 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 专用 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:60 系列:- 类型:可变增益放大器 应用:CATV 安装类型:表面贴装 封装/外壳:20-WQFN 裸露焊盘 供应商设备封装:20-TQFN-EP（5x5） 包装:托盘 |
| ADA4960-1ACPZ-RL | 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 专用 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:60 系列:- 类型:可变增益放大器 应用:CATV 安装类型:表面贴装 封装/外壳:20-WQFN 裸露焊盘 供应商设备封装:20-TQFN-EP（5x5） 包装:托盘 |
| ADA4961ACPZN-R7 | 功能描述:RF Amplifier IC 1.8GHz ~ 3.2GHz 24-LFCSP (4x4) 制造商:analog devices inc. 系列:- 包装:剪切带（CT） 零件状态:在售 频率:1.8GHz ~ 3.2GHz P1dB:17.8dBm 增益:18dB 噪声系数:5.5dB RF 类型:- 电压 - 电源:3.3 V ~ 5 V 电流 - 电源:15mA 测试频率:- 封装/外壳:24-WFQFN 裸露焊盘 供应商器件封装:24-LFCSP（4x4） 标准包装:1 |
| ADA5200IAA6CS | 制造商:Advanced Micro Devices 功能描述: |
| ADA60 | 制造商:Panduit Corp 功能描述: |
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