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参数资料
| 型号： | ADF4213BCPZ-REEL7 |
| 厂商： | ANALOG DEVICES INC |
| 元件分类： | PLL合成/DDS/VCOs |
| 英文描述： | PLL FREQUENCY SYNTHESIZER, 3000 MHz, QCC20 |
| 封装： | CSP-20 |
| 文件页数： | 11/20页 |
| 文件大小： | 252K |
| 代理商： | ADF4213BCPZ-REEL7 |
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
–19–
PCB Guidelines for Chip Scale Package
The lands on the chip scale package (CP-20), are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This will ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be clearance of at least 0.25 mm between the thermal
pad and inner edges of the pad pattern. This will ensure that
shorting is avoided.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Thin Shrink Small Outline Package (TSSOP)
(RU-20)
20
11
10
1
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
0.260 (6.60)
0.252 (6.40)
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433 (1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
0
Chip Scale Package
(CP-20)
1
20
5
6
11
16
15
BOTTOM
VIEW
10
0.080 (2.25)
0.083 (2.10) SQ
0.077 (1.95)
0.024 (0.60)
0.017 (0.42)
0.009 (0.24)
0.024 (0.60)
0.017 (0.42)
0.009 (0.24)
0.030 (0.75)
0.022 (0.60)
0.014 (0.50)
0.012 (0.30)
0.009 (0.23)
0.007 (0.18)
0.080 (2.00)
REF
0.010 (0.25)
MIN
0.020 (0.50)
BSC
12 MAX
0.008 (0.20)
REF
0.031 (0.80) MAX
0.026 (0.65) NOM
0.002 (0.05)
0.0004 (0.01)
0.0 (0.0)
0.035 (0.90) MAX
0.033 (0.85) NOM
SEATING
PLANE
CONTROLLING DIMENSIONS ARE IN MILLIMETERS
PIN 1
INDICATOR
TOP
VIEW
0.148 (3.75)
BSC SQ
0.157 (4.0)
BSC SQ
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
grid pitch. The via diameter should be between 0.3 mm and
0.33 mm and the via barrel should be plated with 1 oz. copper
to plug the via. The user should connect the printed circuit
board pad to AGND.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADF4213BCPZ-RL | 功能描述:IC PLL FREQ SYNTHESIZER 20LFCSP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:- 产品变化通告:Product Discontinuation 04/May/2011 标准包装:96 系列:- 类型:时钟倍频器，零延迟缓冲器 PLL:带旁路 输入:LVTTL 输出:LVTTL 电路数:1 比率 - 输入:输出:1:8 差分 - 输入:输出:无/无 频率 - 最大:133.3MHz 除法器/乘法器:是/无 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:管件 其它名称:23S08-5HPGG |
| ADF4213BCPZ-RL7 | 制造商:Analog Devices 功能描述:PLL Frequency Synthesizer Dual 20-Pin LFCSP EP T/R |
| ADF4213BRU | 制造商:Rochester Electronics LLC 功能描述:DUAL PLL,2.5/1.1GHZ I.C - Bulk 制造商:Analog Devices 功能描述: |
| ADF4213BRU-REEL | 功能描述:IC PLL FREQ SYNTHESIZER 20-TSSOP RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:- 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ADF4213BRU-REEL7 | 制造商:Rochester Electronics LLC 功能描述:DUAL PLL,2.5/1.1GHZ I.C - Tape and Reel 制造商:Analog Devices 功能描述: |
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