参数资料
| 型号： | ADF4360-1BCPZRL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 15/24页 |
| 文件大小： | 0K |
| 描述： | IC SYNTHESIZER VCO 24LFCSP |
| 标准包装： | 5,000 |
| 类型： | 扇出配送，整数-N，合成器（RF） |
| PLL： | 是 |
| 输入： | CMOS，TTL |
| 输出： | 时钟 |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:2 |
| 差分 - 输入:输出： | 无/无 |
| 频率 - 最大： | 2.45GHz |
| 除法器/乘法器： | 是/无 |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 24-LFCSP-VQ（4x4） |
| 包装： | 带卷 (TR) |
| 配用： | EVAL-ADF4360-1EBZ1-ND - BOARD EVALUATION FOR ADF4360-1 |
ADF4360-1
Data Sheet
Rev. C | Page 22 of 24
PCB DESIGN GUIDELINES FOR CHIP-SCALE PACKAGE
The leads on the chip-scale package (CP-24) are rectangular.
The printed circuit board pad for these should be 0.1 mm long-
er than the package lead length and 0.05 mm wider than the
package lead width. The lead should be centered on the pad to
ensure that the solder joint size is maximized.
The bottom of the chip-scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that short-
ing is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm, and the via barrel should be plated with 1 ounce
of copper to plug the via.
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
OUTPUT MATCHING
There are a number of ways to match the output of the
ADF4360-1 for optimum operation; the most basic is to use a
50 resistor to VVCO. A dc bypass capacitor of 100 pF is con-
nected in series, as shown Figure 21. Because the resistor is not
frequency dependent, this provides a good broadband match.
The output power in this circuit typically gives 6 dBm output
power into a 50 load.
100pF
04414-025
RFOUT
VVCO
50
51
Figure 21. Simple ADF4360-1 Output Stage
A better solution is to use a shunt inductor (acting as an RF
choke) to VVCO. This gives a better match and hence more
output power. Additionally, a series inductor is added after the
dc bypass capacitor to provide a resonant LC circuit. This tunes
the oscillator output and provides approximately 10 dB addi-
tional rejection of the second harmonic. The shunt inductor
needs to be a relatively high value (>40 nH).
Experiments have shown that Figure 22 provides an excellent
match to 50 over the operating range of the ADF4360-1. This
gives approximately 4 dBm output power across the frequency
range of the ADF4360-1. Both single-ended architectures can
be examined using the EV-ADF4360-1EB1 evaluation board.
3.9nH
47nH
1.5pF
04414-026
RFOUT
VVCO
50
Figure 22. Optimum ADF4360-1 Output Stage
If the user does not need the differential outputs available on
the ADF4360-1, the user may either terminate the unused out-
put or combine both outputs using a balun. The circuit in Fig-
ure 23 shows how best to combine the outputs.
1nH
3.6nH
47nH
3.6nH
1.5pF
10pF
1.5pF
50
1nH
RFOUTA
VVCO
RFOUTB
04414-027
Figure 23. Balun for Combining ADF4360-1 RF Outputs
The circuit in Figure 23 is a lumped-lattice-type LC balun. It is
designed for a center frequency of 2.2 GHz and outputs 1.0 dBm
at this frequency. The series 1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each
input, and the remainder of the circuit is used to shift the
output of one RF input by +90° and the second by 90°, thus
combining the two. The action of the 3.6 nH inductor and the
1.5 pF capacitor accomplish this. The 47 nH is used to provide
an RF choke in order to feed the supply voltage, and the 10 pF
capacitor provides the necessary dc block. To ensure good RF
performance, the circuits in Figure 22 and Figure 23 were im-
plemented with Coilcraft 0402/0603 inductors and AVX 0402
thin-film capacitors.
Alternatively, instead of the LC balun shown in Figure 23, both
outputs may be combined using a 180° rat-race coupler.
相关PDF资料 |
PDF描述 |
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| ADF4360-0BCPZRL | IC SYNTHESIZER VCO 24LFCSP |
| SY89229UMG | IC CLK DIVIDER /3/5 LVDS 16-MLF |
| VE-27L-MW-S | CONVERTER MOD DC/DC 28V 100W |
| VE-BWB-MV-S | CONVERTER MOD DC/DC 95V 150W |
| VI-2T2-MY-F3 | CONVERTER MOD DC/DC 15V 50W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ADF4360-1BCPZRL7 | 功能描述:IC SYNTHESIZER VCO 24LFCSP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:- 标准包装:1,000 系列:Precision Edge® 类型:时钟/频率合成器 PLL:无 输入:CML，PECL 输出:CML 电路数:1 比率 - 输入:输出:2:1 差分 - 输入:输出:是/是 频率 - 最大:10.7GHz 除法器/乘法器:无/无 电源电压:2.375 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VFQFN 裸露焊盘，16-MLF? 供应商设备封装:16-MLF?（3x3） 包装:带卷 (TR) 其它名称:SY58052UMGTRSY58052UMGTR-ND |
| ADF4360-1SP1BCPZ | 制造商:Analog Devices 功能描述: |
| ADF4360-2 | 制造商:AD 制造商全称:Analog Devices 功能描述:Integrated Synthesizer and VCO |
| ADF4360-2_12 | 制造商:AD 制造商全称:Analog Devices 功能描述:Integrated Synthesizer and VCO |
| ADF4360-28CPZRL7 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
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