参数资料
型号: ADG1234YCPZ-REEL7
厂商: Analog Devices Inc
文件页数: 8/16页
文件大小: 0K
描述: IC SWITCH QUAD SPDT 20LFCSP
产品培训模块: iCMOS™ Switches and Multiplexers for Data Acquisition
Switch Fundamentals
标准包装: 1
系列: iCMOS®
功能: 开关
电路: 4 x SPDT - NC/NO
导通状态电阻: 475 欧姆
电压电源: 单/双电源
电压 - 电源,单路/双路(±): 12V,±15V
电流 - 电源: 260µA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-VFQFN 裸露焊盘,CSP
供应商设备封装: 20-LFCSP-VQ
包装: 标准包装
产品目录页面: 801 (CN2011-ZH PDF)
其它名称: ADG1234YCPZ-REEL7DKR
ADG1233/ADG1234
Rev. B | Page 16 of 16
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
2.25
2.10 SQ
1.95
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
PIN 1
INDICATOR
0.25 MIN
07
28
08
-A
0.75
0.60
0.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
3.75
BCS SQ
4.00
BSC SQ
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
01
25
08
-B
1
0.50
BSC
PIN 1
INDICATOR
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
2.25
2.10 SQ
1.95
20
6
16
10
11
15
5
EXPOSED
PAD
(BOTTOM VIEW)
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 38. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG1233YRUZ1
40°C to +125°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
ADG1233YRUZ-REEL71
40°C to +125°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
ADG1233YCPZ-REEL1
40°C to +125°C
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-16-4
ADG1233YCPZ-REEL71
40°C to +125°C
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-16-4
ADG1234YRUZ1
40°C to +125°C
20-Lead Thin Shrink Small Outline Package (TSSOP)
RU-20
ADG1234YRUZ-REEL71
40°C to +125°C
20-Lead Thin Shrink Small Outline Package (TSSOP)
RU-20
ADG1234YCPZ-REEL1
40°C to +125°C
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-20-1
ADG1234YCPZ-REEL71
40°C to +125°C
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-20-1
1 Z = RoHS Compliant Part.
2006–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05743-0-
2/09(B)
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