参数资料
型号: ADG1436YRUZ-REEL7
厂商: Analog Devices Inc
文件页数: 1/16页
文件大小: 0K
描述: IC SWITCH DUAL SPDT 16TSSOP
标准包装: 1,000
系列: iCMOS®
功能: 开关
电路: 2 x SPDT - NC/NO
导通状态电阻: 3.5 欧姆
电压电源: 单/双电源
电压 - 电源,单路/双路(±): 5 V ~ 16.5 V,±4.5 V ~ 16.5 V
电流 - 电源: 170µA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 带卷 (TR)
1.5 Ω On Resistance,
±15 V/12 V/±5 V, iCMOS, Dual SPDT Switch
ADG1436
Rev. A
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rightsofthirdpartiesthatmayresultfromitsuse.Specificationssubjecttochangewithoutnotice.No
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Fax: 781.461.3113
2008–2009 Analog Devices, Inc. All rights reserved.
FEATURES
1.5 Ω on resistance
0.3 Ω on-resistance flatness
0.1 Ω on-resistance match between channels
Continuous current per channel
LFCSP package: up to 400 mA
TSSOP package: up to 260 mA
Fully specified at +12 V, ±15 V, and ±5 V
No VL supply required
3 V logic-compatible inputs
Rail-to-rail operation
16-lead TSSOP and 4 mm × 4 mm, 16-lead LFCSP packages
APPLICATIONS
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Audio signal routing
Communication systems
Relay replacement
FUNCTIONAL BLOCK DIAGRAMS
ADG1436
S1A
S1B
IN1
S2A
S2B
IN2
D1
D2
SWITCHES SHOWN FOR A ONE-INPUT LOGIC.
06
81
7-
0
01
Figure 1. TSSOP Package
ADG1436
S2A
D2
S2B
S1A
D1
S1B
IN2
EN
IN1
LOGIC
SWITCHES SHOWN FOR A ONE-INPUT LOGIC.
06
81
7-
0
02
Figure 2. LFCSP Package
GENERAL DESCRIPTION
The ADG1436 is a monolithic CMOS device containing two
independently selectable SPDT switches. An EN input on the
LFCSP package is used to enable or disable the device. When
disabled, all channels are switched off. Each switch conducts
equally well in both directions when on and has an input signal
range that extends to the supplies. In the off condition, signal
levels up to the supplies are blocked. Both switches exhibit
break-before-make switching action for use in multiplexer
applications.
The ADG1436 is designed on an iCMOS process. iCMOS
(industrial-CMOS) is a modular manufacturing process combining
high voltage CMOS (complementary metal-oxide semiconductor)
and bipolar technologies. It enables the development of a wide
range of high performance analog ICs capable of 33 V operation
in a footprint that no previous generation of high voltage parts
has been able to achieve. Unlike analog ICs using conventional
CMOS processes, iCMOS components can tolerate high supply
voltages while providing increased performance, dramatically
lower power consumption, and reduced package size.
The on-resistance profile is very flat over the full analog input
range, ensuring excellent linearity and low distortion when
switching audio signals. iCMOS construction ensures ultralow
power dissipation, making the part ideally suited for portable
and battery-powered instruments.
PRODUCT HIGHLIGHTS
1.
2.6 Ω maximum on resistance over temperature.
2.
Minimum distortion.
3.
Ultralow power dissipation: <0.03 μW.
4.
16-lead TSSOP and 16-lead 4 mm × 4 mm LFCSP packages.
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