参数资料
型号: ADG1633BRUZ
厂商: Analog Devices Inc
文件页数: 19/20页
文件大小: 0K
描述: IC SWITCH TRPL SPDT 16TSSOP
标准包装: 96
系列: iCMOS®
功能: 开关
电路: 3 x SPDT - NC/NO
导通状态电阻: 4.5 欧姆
电压电源: 单/双电源
电压 - 电源,单路/双路(±): 3.3 V ~ 16 V,±1.65 V ~ 4 V
电流 - 电源: 300µA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 托盘
产品目录页面: 801 (CN2011-ZH PDF)
ADG1633/ADG1634
Rev. 0 | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 7.
Parameter
Rating
VDD to VSS
18 V
VDD to GND
0.3 V to +18 V
VSS to GND
+0.3 V to 18 V
Analog Inputs1
VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1
GND 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
450 mA (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or D2
Data + 15%
Operating Temperature Range
Industrial (Y Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
16-Lead TSSOP, θJA Thermal
Impedance, 0 Airflow (4-
Layer Board)
112.6°C/W
20-Lead TSSOP, θJA Thermal
Impedance, 0 Airflow
(4-Layer Board)
95°C/W
16-Lead LFCSP (3 mm × 3 mm),
θJA Thermal Impedance, 0
Airflow (4-Layer Board)
48.7°C/W
16-Lead LFCSP (4 mm × 4 mm),
θJA Thermal Impedance, 0
Airflow (4-Layer Board)
30.4°C/W
Reflow Soldering Peak
Temperature, Pb free
260°C
ESD CAUTION
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
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