参数资料
| 型号： | ADG3304BRUZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | IC XLATOR 4CH 1.2/5.5V 14-TSSOP |
| 标准包装： | 96 |
| 逻辑功能： | 变换器，双向 |
| 位数： | 4 |
| 输入类型： | 逻辑 |
| 输出类型： | 逻辑 |
| 数据速率： | 50Mbps |
| 通道数： | 4 |
| 输出/通道数目： | 1 |
| 差分 - 输入:输出： | 无/无 |
| 传输延迟（最大）： | 6ns |
| 电源电压： | 1.15 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 14-TSSOP |
| 包装： | 管件 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
ADG3304
Data Sheet
Rev. D | Page 20 of 20
3.75
BCS SQ
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
1
0.50
BSC
PIN 1
INDICATOR
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
2.25
2.10 SQ
1.95
20
6
16
10
11
15
5
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-
09-
2012-
B
BOTTOM VIEW
EXPOSED
PAD
4.10
4.00 SQ
3.90
Figure 44. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Branding3
Package
Option
ADG3304BRUZ
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG3304BRUZ-REEL
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG3304BRUZ-REEL7
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
ADG3304BCPZ-REEL
40°C to +85°C
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-20-1
ADG3304BCPZ-REEL7
40°C to +85°C
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-20-1
ADG3304BCBZ-REEL
40°C to +85°C
12-Ball Wafer Level Chip Scale Package [WLCSP]
SDC
CB-12-1
ADG3304BCBZ-REEL7
40°C to +85°C
12-Ball Wafer Level Chip Scale Package [WLCSP]
SDC
CB-12-1
ADG3304WBRUZ-REEL
40°C to +85°C
14-Lead Thin Shrink Small Outline Package [TSSOP]
RU-14
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
3
Branding on these packages is limited to three characters due to space constraints.
AUTOMOTIVE PRODUCTS
The ADG3304W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
2005–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04860-0-4/13(D)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADG3304BRUZ | 制造商:Analog Devices 功能描述:IC 4CH LOGIC LEVEL TRANSLATOR TSSOP-14 |
| ADG3304BRUZ-REEL | 功能描述:IC XLATOR 4CH 1.2/5.5V 14TSSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 变换器 系列:- 产品培训模块:Logic Packages 标准包装:2,500 系列:- 逻辑功能:变换器，双向 位数:2 输入类型:电压 输出类型:电压 数据速率:- 通道数:2 输出/通道数目:1 差分 - 输入:输出:无/无 传输延迟（最大）:1.5ns 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-TSSOP 包装:带卷 (TR) 其它名称:935284857118GTL2002DP/S440-TGTL2002DP/S440-T-ND |
| ADG3304BRUZ-REEL7 | 功能描述:IC XLATR BIDIR V-LVL 4CH 14TSSOP RoHS:是 类别:集成电路 (IC) >> 逻辑 - 变换器 系列:- 标准包装:1 系列:100ELT 逻辑功能:变换器 位数:1 输入类型:TTL 输出类型:差分 数据速率:- 通道数:2 输出/通道数目:1 差分 - 输入:输出:无/是 传输延迟（最大）:0.6ns 电源电压:3 V ~ 3.8 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:Digi-Reel® 产品目录页面:1088 (CN2011-ZH PDF) 其它名称:576-1360-6 |
| ADG3304SRU-EP-RL7 | 功能描述:转换 - 电压电平 1.2 V - 5.5 V 4-channel BI-DIR TRANS IC RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| ADG3304SRUZ-EP-RL7 | 功能描述:IC XLATR BIDIR 1.15-5.5V 14TSSOP 制造商:analog devices inc. 系列:- 零件状态:在售 转换器类型:电压电平 通道类型:双向 电路数:1 每个电路的通道数:4 电压 - VCCA:1.15V ~ 5.5V 电压?- VCCB:1.65V ~ 5.5V 输入信号:- 输出信号:- 输出类型:三态，非反相 数据速率:50Mbps 工作温度:-55°C ~ 125°C（TA） 特性:- 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商器件封装:14-TSSOP 标准包装:1,000 |
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