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| 型号： | ADG428BRZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 8X1 18SOIC |
| 产品培训模块： | iCMOS™ Switches and Multiplexers for Data Acquisition Switch Fundamentals |
| 标准包装： | 41 |
| 系列： | LC²MOS |
| 功能： | 多路复用器 |
| 电路： | 1 x 8:1 |
| 导通状态电阻： | 90 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 12V，±15V |
| 电流 - 电源： | 20µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 18-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 18-SO |
| 包装： | 管件 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
REV. C
ADG428/ADG429
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG428/ADG429 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25
°C unless otherwise noted.)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
Analog, Digital Inputs
2
. . . . . . . . . . VSS – 2 V to VDD + 2 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 73
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300
°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 115
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 77
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
PLCC Package, Power Dissipation . . . . . . . . . . . . . . . 800 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 90
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at A, EN,
WR, RS, S or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given.
ORDERING GUIDE
Model
1
Temperature Range
Package Options
2
ADG428BN
–40
°C to +85°C
N-18
ADG428BP
–40
°C to +85°C
P-20A
ADG428BR
–40
°C to +85°C
R-18
ADG428TQ
–55
°C to +125°CQ-18
ADG429BN
–40
°C to +85°C
N-18
ADG429BP
–40
°C to +85°C
P-20A
ADG429TQ
–55
°C to +125°CQ-18
NOTES
1For availability of MIL-STD-883, Class B processed parts, contact factory.
2N = Plastic DIP; P = Plastic Leaded Chip Carrier (PLCC); Q = Cerdip;
R = Small Outline IC (SOIC).
ADG429 PIN CONFIGURATIONS
DIP/SOIC
PLCC
TOP VIEW
(Not to Scale)
18
17
16
15
14
13
12
11
10
1
2
3
4
5
6
7
8
9
ADG428
D
S4
WR
A0
EN
VSS
S3
S2
S1
S8
S7
RS
A1
A2
GND
S6
S5
VDD
3
2
1
20
19
9
10
11
12
13
18
17
16
15
14
4
5
6
7
8
TOP VIEW
(Not to Scale)
PIN 1
IDENTIFIER
NC = NO CONNECT
EN
VSS
S1
S2
S3
A2
GND
VDD
S5
S6
ADG428
A0
WR
NC
RS
A1
S4
D
NC
S8
S7
DIP
PLCC
TOP VIEW
(Not to Scale)
18
17
16
15
14
13
12
11
10
1
2
3
4
5
6
7
8
9
ADG429
DA
S4A
WR
A0
EN
VSS
S3A
S2A
S1A
DB
S4B
RS
A1
GND
VDD
S3B
S2B
S1B
3
2
1
20
19
9
10
11
12
13
18
17
16
15
14
4
5
6
7
8
TOP VIEW
(Not to Scale)
PIN 1
IDENTIFIER
NC = NO CONNECT
EN
VSS
S1A
S2A
S3A
GND
VDD
S1B
S2B
S3B
ADG429
A0
WR
NC
RS
A1
S4A
DA
NC
DB
S4B
ADG428 PIN CONFIGURATIONS
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADG428BRZ | 制造商:Analog Devices 功能描述:IC, MUX, CMOS, 8:1, SOIC-18 |
| ADG428BRZ-REEL | 功能描述:IC MULTIPLEXER 8X1 18SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:LC²MOS 特色产品:MicroPak? 标准包装:1 系列:- 功能:开关 电路:2 x SPST - NC 导通状态电阻:500 毫欧 电压电源:单电源 电压 - 电源，单路/双路(±):1.4 V ~ 4.3 V 电流 - 电源:150nA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-XFDFN 供应商设备封装:8-XSON，SOT833-1 （1.95x1） 包装:Digi-Reel® 其它名称:568-5557-6 |
| ADG428TQ | 制造商:Analog Devices 功能描述: |
| ADG428TQ/883B | 制造商:未知厂家 制造商全称:未知厂家 功能描述:8-Channel Analog Multiplexer |
| ADG429 | 制造商:AD 制造商全称:Analog Devices 功能描述:LC2MOS Latchable 4-/8-Channel High Performance Analog Multiplexers |
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