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型号： ADG451BRUZ
厂商： Analog Devices Inc
文件页数： 8/16页
文件大小： 0K
描述： IC SWITCH QUAD SPST 16TSSOP
产品培训模块： iCMOS™ Switches and Multiplexers for Data Acquisition
Switch Fundamentals
标准包装： 96
系列： LC²MOS
功能： 开关
电路： 4 x SPST - NC
导通状态电阻： 8 欧姆
电压电源： 单/双电源
电压 - 电源，单路/双路(±)： 12V，±15V
电流 - 电源： 100pA
工作温度： -40°C ~ 85°C
安装类型： 表面贴装
封装/外壳： 16-TSSOP（0.173"，4.40mm 宽）
供应商设备封装： 16-TSSOP
包装： 管件
产品目录页面： 800 (CN2011-ZH PDF)
ADG451/ADG452/ADG453
Rev. C | Page 16 of 16
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG451BN
40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
N-16
ADG451BNZ1
40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
N-16
ADG451BR
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG451BR-REEL
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG451BR-REEL7
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG451BRZ1
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG451BRZ-REEL1
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG451BRZ-REEL71
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG451BRUZ1
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG451BRUZ- REEL1
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG451BRUZ- REEL71
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG451BCHIPS
DIE
ADG452BN
40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
N-16
ADG452BNZ1
40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
N-16
ADG452BR
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG452BR-REEL
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG452BR-REEL7
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG452BRZ1
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG452BRZ-REEL1
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG452BRZ-REEL71
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG452BRUZ1
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG452BRUZ-REEL1
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG452BRUZ-REEL71
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG453BN
40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
N-16
ADG453BNZ1
40°C to +85°C
16-Lead Plastic Dual In-Line Package [PDIP]
N-16
ADG453BR
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG453BR-REEL
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG453BR-REEL7
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG453BRZ1
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG453BRZ-REEL1
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG453BRZ-REEL71
40°C to +85°C
16-Lead Standard Small Outline Package [SOIC_N]
R-16
ADG453BRUZ1
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG453BRUZ-REEL1
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG453BRUZ-REEL71
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
1 Z = Pb-free part.
2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C05239-0-
10/06(C)
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相关代理商/技术参数
参数描述
ADG451BRUZ 制造商:Analog Devices 功能描述:Analog Switch / Multiplexer (Mux) IC
ADG451BRUZ1 制造商:AD 制造商全称:Analog Devices 功能描述:LC2MOS 5 ?? RON SPST Switches
ADG451BRUZ-REEL 功能描述:IC SWITCH QUAD SPST 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:LC²MOS 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR)
ADG451BRUZ-REEL1 制造商:AD 制造商全称:Analog Devices 功能描述:LC2MOS 5 ?? RON SPST Switches
ADG451BRUZ-REEL7 功能描述:IC SWITCH QUAD SPST 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:LC²MOS 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR)
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