ADG506A/ADG507A
–8–
REV. C
C1150c–0–6/98
PRINTED
IN
U.S.A.
TERMINOLOGY
RON
Ohmic resistance between terminals D and S
RON Match
Difference between the RON of any two channels
RON Drift
Change in RON versus temperature
IS (OFF)
Source terminal leakage current when the switch
is off
ID (OFF)
Drain terminal leakage current when the switch
is off
ID (ON)
Leakage current that flows from the closed switch
into the body
VS (VD)
Analog voltage on terminal S or D
CS (OFF)
Channel input capacitance for “OFF” condition
CD (OFF)
Channel output capacitance for “OFF” condition
CIN
Digital input capacitance
tON (EN)
Delay time between the 50% and 90% points of
the digital input and switch “ON” condition
tOFF (EN)
Delay time between the 50% and 10% points of
the digital input and switch “OFF” condition
tTRANSITION
Delay time between the 50% and 90% points of
the digital inputs and switch “ON” condition
when switching from one address state to
another
tOPEN
“OFF” time measured between 50% points of
both switches when switching from one address
state to another
VINL
Maximum input voltage for Logic “0”
VINH
Minimum input voltage for Logic “1”
IINL (IINH)
Input current of the digital input
VDD
Most positive voltage supply
VSS
Most negative voltage supply
IDD
Positive supply current
ISS
Negative supply current
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Plastic DIP (Suffix N)
1.45(36.83)
1.44 (36.58)
0.550 (13.97)
0.53 (13.47)
0.020 (0.508)
0.015 (0.381)
0.175 (4.45)
0.12 (3.05)
0.2
(5.08)
MAX
0.105 (2.67)
0.095 (2.42)
0.065 (1.66)
0.045 (1.15)
0.606 (15.4)
0.594 (15.09)
0.012 (0.305)
0.008 (0.203)
0.16 (4.07)
0.14 (3.56)
15
0
LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
LEADS ARE SOLDER OR TIN PLATED KOVAR OR ALLOY 42
28-Lead Cerdip (Suffix Q)
0.525 (13.33)
0.515 (13.08)
GLASS
SEALANT
15
°
0
°
0.18(4.57)
MAX
0.012 (0.305)
0.008 (0.203)
0.22 (5.59)
MAX
1.490 (37.84) MAX
0.125
(3.175)
MIN
0.02 (0.5)
0.016 (0.406)
0.11 (2.79)
0.099 (2.28)
0.06 (1.52)
0.05 (1.27)
0.62 (15.74)
0.59 (14.93)
LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
LEADS ARE SOLDER OR TIN PLATED KOVAR OR ALLOY 42
28-Lead SOIC (Suffix R)
SEATING
PLANE
0.0118 (0.30)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.1043 (2.65)
0.0926 (2.35)
0.0500
(1.27)
BSC
0.0125 (0.32)
0.0091 (0.23)
0.0500 (1.27)
0.0157 (0.40)
8°
0°
0.0291 (0.74)
0.0098 (0.25)
x 45°
0.7125 (18.10)
0.6969 (17.70)
0.4193
(10.65)
0.3937
(10.00)
0.2992
(7.60)
0.2914
(7.40)
PIN 1
28
15
14
1
28-Lead TSSOP (Suffix RU)
28
15
14
1
0.386 (9.80)
0.378 (9.60)
0.256
(6.50)
0.246
(6.25)
0.177
(4.50)
0.169
(4.30)
PIN 1
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433
(1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
°
0
°
28-Terminal Plastic Leaded Chip Carrier (Suffix P)
4
PIN 1
IDENTIFIER
5
26
25
11
12
19
18
TOP VIEW
(PINS DOWN)
0.498 (12.57)
0.485 (12.32)
SQ
0.456 (11.582)
0.450 (11.430) SQ
0.021 (0.533)
0.013 (0.331)
0.430 (10.5)
0.390 (9.9)
0.032 (0.812)
0.026 (0.661)
0.180 (4.51)
0.165 (4.20)
0.120 (3.04)
0.090 (2.29)
0.050
0.005
01.27
0.13
28-Terminal Leadless Ceramic Chip Carrier (Suffix E)
1
28
5
11
12
18
26
BOTTOM
VIEW
19
4
2
5
0.028 (0.71)
0.022 (0.56)
45
° TYP
0.015 (0.38)
MIN
0.055 (1.40)
0.045 (1.14)
0.050
(1.27)
BSC
0.075
(1.91)
REF
0.011 (0.28)
0.007 (0.18)
R TYP
0.095 (2.41)
0.075 (1.90)
0.150
(3.51)
BSC
0.300 (7.62)
BSC
0.200
(5.08)
BSC
0.075
(1.91)
REF
0.458 (11.63)
0.442 (11.23)
SQ
0.458
(11.63)
MAX
SQ
0.100 (2.54)
0.064 (1.63)
0.088 (2.24)
0.054 (1.37)