参数资料
型号: ADG509FBRWZ
厂商: Analog Devices Inc
文件页数: 9/20页
文件大小: 0K
描述: IC MULTIPLEXER DUAL 4X1 16SOIC
产品培训模块: Switch Fundamentals
标准包装: 47
功能: 多路复用器
电路: 2 x 4:1
导通状态电阻: 300 欧姆
电压电源: 双电源
电压 - 电源,单路/双路(±): ±15V
电流 - 电源: 100nA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC W
包装: 管件
ADG508F/ADG509F/ADG528F
Rev. E | Page 17 of 20
COMPLIANT TO JEDEC STANDARDS MO-047-AA
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.020 (0.50)
R
BOTTOM
VIEW
(PINS UP)
0.021 (0.53)
0.013 (0.33)
0.330 (8.38)
0.290 (7.37)
0.032 (0.81)
0.026 (0.66)
0.056 (1.42)
0.042 (1.07)
0.20 (0.51)
MIN
0.120 (3.04)
0.090 (2.29)
3
4
19
18
8
9
14
13
TOP VIEW
(PINS DOWN)
0.395 (10.03)
0.385 (9.78)
SQ
0.356 (9.04)
0.350 (8.89)
SQ
0.048 (1.22 )
0.042 (1.07)
0.048 (1.22)
0.042 (1.07)
0.020
(0.51)
R
0.050
(1.27)
BSC
0.180 (4.57)
0.165 (4.19)
0.045 (1.14)
0.025 (0.64)
R
PIN 1
IDENTIFIER
Figure 38. 20-Lead Plastic Leaded Chip Carrier [PLCC]
(P-20)
Dimensions shown in inches and (millimeters)
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.15
0.05
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 39. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
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