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参数资料
| 型号： | ADG704BRMZ-REEL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 4/8页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 4X1 10MSOP |
| 产品培训模块： | Switch Fundamentals |
| 标准包装： | 3,000 |
| 功能： | 多路复用器 |
| 电路： | 1 x 4:1 |
| 导通状态电阻： | 4 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V |
| 电流 - 电源： | 1nA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
ADG704
–4–
REV. A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG704 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
TERMINOLOGY
VDD
Most positive power supply potential.
GND
Ground (0 V) reference.
S
Source terminal. May be an input or output.
D
Drain terminal. May be an input or output.
A0, A1
Logic control inputs.
EN
Logic control input.
RON
Ohmic resistance between D and S.
R
ON
On resistance match between any two chan-
nels i.e., RONmax–RONmin.
RFLAT(ON)
Flatness is defined as the difference between
the maximum and minimum value of on resis-
tance as measured over the specified analog
signal range.
ID (OFF)
Drain leakage current with the switch “OFF.”
IS (OFF)
Source leakage current with the switch “OFF.”
ID, IS (ON)
Channel leakage current with the switch “ON.”
VD (VS)
Analog voltage on terminals D, S.
CS (OFF)
“OFF” switch source capacitance.
CD (OFF)
“OFF” switch drain capacitance.
CD, CS (ON)
“ON” switch capacitance.
tON
Delay between applying the digital control
input and the output switching on. See Test
Circuit 4.
tOFF
Delay between applying the digital control
input and the output switching off.
tD
“OFF” time or “ON” time measured between
the 90% points of both switches, when switching
from one address state to another. See Test
Circuit 5.
Crosstalk
A measure of unwanted signal that is coupled
through from one channel to another as a
result of parasitic capacitance.
Off Isolation
A measure of unwanted signal coupling
through an “OFF” switch.
Charge
A measure of the glitch impulse transferred
Injection
from the digital input to the analog output
during switching.
Bandwidth
The frequency at which the output is attenu-
ated by –3 dBs.
On Response
The frequency response of the “ON” switch.
On Loss
The voltage drop across the “ON” switch,
seen on the On Response vs. Frequency plot
as how many dBs the signal is away from 0 dB
at very low frequencies.
Table I. Truth Table
A1
A0
EN
ON Switch
X
0
NONE
00
1
01
1
2
10
1
3
11
1
4
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . . –0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 315 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 206
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
ORDERING GUIDE
Temperature
Package
Model
Range
Brand
1
Option
2
ADG704BRM
–40
°C to +85°C
S9B
RM-10
NOTES
1Brand = Due to small package size, these three characters represent the part
number.
2RM =
SOIC.
PIN CONFIGURATION
(10-Lead
SOIC)
TOP VIEW
(Not to Scale)
10
9
8
7
6
1
2
3
4
5
A0
S1
GND
S3
EN
A1
S2
D
S4
VDD
ADG704
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