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| 型号： | ADG708BRUZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 8X1 16TSSOP |
| 产品培训模块： | iCMOS™ Switches and Multiplexers for Data Acquisition Switch Fundamentals |
| 标准包装： | 96 |
| 功能： | 多路复用器 |
| 电路： | 1 x 8:1 |
| 导通状态电阻： | 4.5 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V，±2.5 V |
| 电流 - 电源： | 1nA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
ADG708/ADG709
Data Sheet
Rev. D | Page 20 of 20
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Package Option
ADG708BRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRU-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708BRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRU-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG708CRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADW54008-0REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRU-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709BRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRUZ
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRUZ-REEL
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG709CRUZ-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54008 models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
2000–2013 Analog Devices, Inc. All rights reserved. Trademarksand
registered trademarks are the property of their respective owners.
D00041-0-1/13(D)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADG708BRUZ-REEL | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ADG708BRUZ-REEL7 | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ADG708CRU | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 其它有关文件:STG4159 View All Specifications 标准包装:5,000 系列:- 功能:开关 电路:1 x SPDT 导通状态电阻:300 毫欧 电压电源:双电源 电压 - 电源，单路/双路(±):±1.65 V ~ 4.8 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:7-WFBGA，FCBGA 供应商设备封装:7-覆晶 包装:带卷 (TR) |
| ADG708CRU-REEL | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ADG708CRU-REEL7 | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:48 系列:- 功能:开关 电路:4 x SPST - NO 导通状态电阻:100 欧姆 电压电源:单/双电源 电压 - 电源，单路/双路(±):2 V ~ 12 V，±2 V ~ 6 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
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