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| 型号： | ADG759BCPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 8/12页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 20LFCSP |
| 产品培训模块： | iCMOS™ Switches and Multiplexers for Data Acquisition Switch Fundamentals |
| 标准包装： | 1 |
| 功能： | 多路复用器 |
| 电路： | 2 x 4:1 |
| 导通状态电阻： | 4.5 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V，±2.5 V |
| 电流 - 电源： | 1nA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 20-LFCSP-VQ |
| 包装： | 托盘 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
ADG758/ADG759
Rev. B | Page 5
ABSOLUTE MAXIMUM RATINGS
TA = 25C, unless otherwise noted.
Parameter
Rating
VDD to VSS
7 V
VDD to GND
–0.3 V to +7 V
VSS to GND
+0.3 V to –3.5 V
Analog Inputs1
VSS – 0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Digital Inputs1
–0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D
100 mA (Pulsed at 1 ms, 10%
Duty Cycle max)
Continuous Current, S or D
30 mA
Operating Temperature Range
Industrial (B Version)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
Chip Scale Package,
θJA Thermal Impedance
32°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1 Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Table I. ADG758 Truth Table
A2
A1
A0
EN
Switch Condition
X
0
NONE
0
1
0
1
2
0
1
0
1
3
0
1
4
1
0
1
5
1
0
1
6
1
0
1
7
1
8
X = Don’t Care
Table II. ADG759 Truth Table
A1
A0
EN
ON Switch Pair
X
0
NONE
0
1
0
1
2
1
0
1
3
1
4
X = Don’t Care
PIN CONFIGURATIONS
02
37
1-
10
2
14
13
12
1
3
4
VDD
15 GND
S5
S6
11 S7
EN
S1
2
VSS
S2
5
S3
7
D
6
S
4
8
N
C
9
N
C
1
0
S
8
1
9
A
0
2
0
N
C
1
8
A
1
7
A
2
1
6
N
C
ADG758
TOP VIEW
(Not to Scale)
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
023
71
-103
14
13
12
1
3
4
VDD
15 GND
S1B
S2B
11 S3B
EN
S1A
2
VSS
S2A
5
S3A
7
D
A
6
S
4
A
8
N
C
9
D
B
1
0
S
4
B
1
9
A
0
2
0
N
C
1
8
N
C
1
7
A
1
6
N
C
ADG759
TOP VIEW
(Not to Scale)
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
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