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| 型号： | ADG774BRZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC MUX/DEMUX QUAD 2X1 16SOIC |
| 产品培训模块： | iCMOS™ Switches and Multiplexers for Data Acquisition Switch Fundamentals |
| 标准包装： | 48 |
| 功能： | 多路复用器/多路分解器 |
| 电路： | 4 x 2:1 |
| 导通状态电阻： | 2.2 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 3.3V，5V |
| 电流 - 电源： | 1nA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
ADG774
–4–
REV. C
ORDERING GUIDE
Model
Temperature Range
Package Descriptions
Package Options
ADG774BR
–40
°C to +125°C
Standard Small Outline Package (SOIC)
R-16
ADG774BR-REEL
–40
°C to +125°C
Standard Small Outline Package (SOIC)
R-16
ADG774BR-REEL7
–40
°C to +125°C
Standard Small Outline Package (SOIC)
R-16
ADG774BRZ
*
–40
°C to +125°C
Standard Small Outline Package (SOIC)
R-16
ADG774BRZ-REEL
*
–40
°C to +125°C
Standard Small Outline Package (SOIC)
R-16
ADG774BRZ-REEL7
*
–40
°C to +125°C
Standard Small Outline Package (SOIC)
R-16
ADG774BRQ
–40
°C to +125°C
Shrink Small Outline Package (QSOP)
RQ-16
ADG774BRQ-REEL
–40
°C to +125°C
Shrink Small Outline Package (QSOP)
RQ-16
ADG774BRQ-REEL7
–40
°C to +125°C
Shrink Small Outline Package (QSOP)
RQ-16
ADG774BRQZ
*
–40
°C to +125°C
Shrink Small Outline Package (QSOP)
RQ-16
ADG774BRQZ-REEL
*
–40
°C to +125°C
Shrink Small Outline Package (QSOP)
RQ-16
ADG774BRQZ-REEL7
*
–40
°C to +125°C
Shrink Small Outline Package (QSOP)
RQ-16
*Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG774 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 100
°C/W
QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . 149.97
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300
°C
I R Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235
°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
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相关代理商/技术参数 |
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| ADG774BRZ-REEL | 功能描述:IC MUX/DEMUX QUAD 2X1 16SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ADG774BRZ-REEL7 | 功能描述:IC MUX/DEMUX QUAD 2X1 16SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ADG779 | 制造商:AD 制造商全称:Analog Devices 功能描述:CMOS 1.8 V to 5.5 V, 2.5 ohm SPDT Switch/2:1 Mux In Tiny SC70 Package |
| ADG779_05 | 制造商:AD 制造商全称:Analog Devices 功能描述:CMOS 1.8 V to 5.5 V, 2.5 ?? SPDT Switch/2:1 Mux in Tiny SC70 Package |
| ADG779BKS | 制造商:AD 制造商全称:Analog Devices 功能描述:CMOS 1.8 V to 5.5 V, 2.5 ohm SPDT Switch/2:1 Mux In Tiny SC70 Package |
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